首页 >IRG4CC50WB>规格书列表
| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
IRG4CC50WB | IGBT Die in Wafer Form 600 V Size 5 WARP Speed 文件：35.62 Kbytes 页数：1 Pages | HITTITE | HITTITE | |
IRG4CC50WB | IGBT Die in Wafer Form 600 V Size 5 WARP Speed | ADI 亚德诺 | ADI | |
TO-247 | IR | |||
TO-247 | IR | |||
TO-247 | IR |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
IR |
22+ |
GA-CHIPS&WAFERS |
6000 |
终端可免费供样,支持BOM配单 |
询价 | ||
IR |
23+ |
GA-CHIPSWAFERS |
8000 |
只做原装现货 |
询价 | ||
IR |
23+ |
GA-CHIPSWAFERS |
7000 |
询价 |
更多IRG4CC50WB供应商
更新时间2026-1-28 14:00:00
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