丝印：NXA；Package：SOT-23；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

德州仪器

丝印：NXA；Package：SOT-23；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

德州仪器

丝印：NXA；Package：SOT-23；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

德州仪器

丝印：NXA；Package：SOT-23；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

德州仪器

丝印：NXA；Package：SOT-23；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

德州仪器

丝印：NXA；Package：SOT-23；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

德州仪器

丝印：NXA；Package：DO-214AA；11 To 170V 600W Surface Mount Transient Voltage Suppressors

Features Glass passivated chip 600W peak pulse power capability with a 10/1000μs waveform, repetitive rate (duty cycle):0.01% High reliability application and automotive grade AEC Q101 qualified Low leakage Uni and Bidirectional unit Excellent clamping capability Very fast response ti

文件：2.90188 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：NXA；Package：DO-214AA；Transient Voltage Suppressors

600 W peak pulse power capability with a 10/1000 s waveform, repetitive rate (duty cycle):0.01 % Low leakage Uni and Bidirectional unit Excellent clamping capability Very fast response time RoHS compliant Features Glass passivated chip High reliability application and automotive

文件：1.58939 Mbytes 页数：4 Pages

LUGUANG

鲁光电子

丝印：NXA；Package：DO-214AA；Surface Mount Transient Voltage Suppressors

文件：917.49 Kbytes 页数：3 Pages

LUGUANG

鲁光电子

丝印：NXA；Package：SMB；Surface Mount Transient Voltage Suppressors

文件：277.03 Kbytes 页数：3 Pages

ANOVA

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