NXH003P120M3F2PTNG

Marking：NXH003P120M3F2PTNG；Package：PIM36；Silicon Carbide (SiC) Module – EliteSiC, 3 mohm SiC M3 MOSFET, 1200 V, 2-PACK Half Bridge Topology, F2 Package with Si3N4 DBC

TheNXH003P120M3F2PTNGisapowermodulecontaining3m/ 1200VSiCMOSFEThalf−bridgeandathermistorwithSi3N4DBCin anF2package. Features •3m/1200VM3SSiCMOSFETHalf−Bridge •Si3N4DBC •Thermistor •Pre−AppliedThermalInterfaceMaterial(TIM) •Press−FitPins •These

NXH004P120M3F2PTHG

Marking：NXH004P120M3F2PTHG；Package：F2HALFBR；Silicon Carbide (SiC) Module – EliteSiC, 4 mohm SiC M3 MOSFET, 1200 V, 2-PACK Half Bridge Topology, F2 Package with HPS DBC

TheNXH004P120M3F2PTHGisapowermodulecontaining4m/ 1200VSiCMOSFEThalf−bridgeandathermistorwithHPSDBCin anF2package. Features •4m/1200VM3SSiCMOSFETHalf−Bridge •HPSDBC •Thermistor •OptionswithPre−AppliedThermalInterfaceMaterial(TIM)and withoutPre−

NXH004P120M3F2PTNG

Marking：NXH004P120M3F2PTNG；Package：PIM36；Silicon Carbide (SiC) Module – EliteSiC, 4 mohm SiC M3 MOSFET, 1200 V, 2-PACK Half Bridge Topology, F2 Package with Si3N4 DBC

TheNXH004P120M3F2PTNGisapowermodulecontaining3m/ 1200VSiCMOSFEThalf−bridgeandathermistorwithSi3N4DBCin anF2package. Features •4m/1200VM3SSiCMOSFETHalf−Bridge •Si3N4DBC •Thermistor •Pre−AppliedThermalInterfaceMaterial(TIM) •Press−FitPins •These

NXH006P120M3F2PTHG

Marking：NXH006P120M3F2PTHG；Package：F2HALFBR；Silicon Carbide (SiC) Module – EliteSiC, 6 mohm, 1200 V, SiC M3 MOSFET, 2-PACK Half Bridge Topology, F2 Package with HPS DBC

TheNXH006P120M3F2PTHGisapowermodulecontaining6m/ 1200VSiCMOSFEThalf−bridgeandathermistorwithHPSDBCin anF2package. Features 6m/1200VM3SSiCMOSFETHalf−Bridge HPSDBC Thermistor Pre−AppliedThermalInterfaceMaterial(TIM) Press−FitPins TheseDevic

NXH006P120MNF2PTG

Marking：NXH006P120MNF2PTG；Package：F2HALFBR；Silicon Carbide (SiC) Module – EliteSiC, 6 mohm SiC M1 MOSFET, 1200 V, 2-PACK Half Bridge Topology, F2 Package

TheNXH006P120MNF2isapowermodulecontainingan6m/ 1200VSiCMOSFEThalf−bridgeandathermistorinanF2package. Features •6m/1200VSiCMOSFETHalf−Bridge •Thermistor •OptionswithPre−AppliedThermalInterfaceMaterial(TIM)and withoutPre−AppliedTIM •OptionswithSo

NXH007F120M3F2PTHG

Marking：NXH007F120M3F2PTHG；Package：F2FULLBR；Silicon Carbide (SiC) Module – EliteSiC, 7 mohm, 1200 V, SiC M3S MOSFET, Full Bridge, F2 Package

TheNXH007F120M3F2PTHGisapowermodulecontaining 7m/1200VSiCMOSFETfull−bridgeandathermistorwithHPS DBCinanF2package. Features •7m/1200VM3SSiCMOSFETFull−Bridge •HPSDBC •Thermistor •OptionswithPre−AppliedThermalInterfaceMaterial(TIM)and withoutPre−Ap

NXH008T120M3F2PTHG

Marking：NXH008T120M3F2PTHG；Package：F2-TNPC；Silicon Carbide (SiC) Module – 8 mohm SiC M3S MOSFET, 1200 V, TNPC Topology, F2 Package

TheNXH008T120M3F2PTHGisapowermodulecontainingan 8m/1200VSiCMOSFETTNPCandathermistorwithHPSDBC inanF2package. Features •8m/1200VM3SSiCMOSFETTNPC •HPSDBC •Thermistor •OptionswithPre−AppliedThermalInterfaceMaterial(TIM)and withoutPre−AppliedTIM

NXH010P120MNF1PG

Marking：NXH010P120MNF1PG；Package：F1-2PACK；F1-2PACK SiC MOSFET Module

GeneralDescription TheNXH010P120MNF1isapowermodulecontainingan 10m/1200VSiCMOSFEThalfbridgeandathermistorinanF1package. Features •10m/1200VSiCMOSFETHalfBridge •Thermistor •OptionsWithPre−AppliedThermalInterfaceMaterial(TIM)and WithoutPre−AppliedTIM

NXH010P120MNF1PG

Marking：NXH010P120MNF1PG；Package：F1-2PACK；Silicon Carbide (SiC) Module – EliteSiC, 10 mohm SiC M1 MOSFET, 1200 V, 2-PACK Half Bridge Topology, F1 Package

GeneralDescription TheNXH010P120MNF1isapowermodulecontainingan 10m/1200VSiCMOSFEThalfbridgeandathermistorinanF1 package. Features •10m/1200VSiCMOSFETHalfBridge •Thermistor •OptionsWithPre−AppliedThermalInterfaceMaterial(TIM)and WithoutPre−AppliedTIM

NXH010P120MNF1PNG

Marking：NXH010P120MNF1PNG；Package：F1-2PACK；F1-2PACK SiC MOSFET Module

GeneralDescription TheNXH010P120MNF1isapowermodulecontainingan 10m/1200VSiCMOSFEThalfbridgeandathermistorinanF1package. Features •10m/1200VSiCMOSFETHalfBridge •Thermistor •OptionsWithPre−AppliedThermalInterfaceMaterial(TIM)and WithoutPre−AppliedTIM