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STGB30H60DLLFBAG数据手册ST中文资料规格书
STGB30H60DLLFBAG规格书详情
描述 Description
This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the new HB series of IGBTs, which represents an optimum compromise between conduction and switching loss to maximize the efficiency of any frequency converter. Furthermore, the slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation.
特性 Features
• AEC-Q101 qualified
• Maximum junction temperature: TJ = 175 °C
• Logic level gate drive
• High speed switching series
• Minimized tail current
• VCE(sat) = 1.7 V (typ.) @ IC = 30 A
• Low VF soft recovery co-packaged diode
• Tight parameters distribution
• Safer paralleling
• Low thermal resistance
技术参数
- 制造商编号
：STGB30H60DLLFBAG
- 生产厂家
：ST
- Package
：D2PAK
- Grade
：Automotive
- VCES_max(V)
：600
- PTOT_max(W)
：260
- Freewheeling diode
：true
- IC_max(@ Tc=100°C)(A)
：30
- IC_max(@ Tc=25°C)(A)
：60
- IF_max(@ Tc=100°C)(A)
：30
- IF_max(@ Tc=25°C)(A)
：60
- VCE(sat)_typ(V)
：1.7
- VF_typ(V)
：1.4
- Qg_typ(nC)
：110
- Eoff_typ(mJ)
：0.6
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
STMicroelectronics |
25+ |
TO-263-3 D?Pak(2 引线 + 接片 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
询价 | ||
ST |
24+ |
D2PAK |
16900 |
支持样品,原装现货,提供技术支持! |
询价 | ||
ST/意法半导体 |
2021+ |
D2PAK-3 |
7600 |
原装现货，欢迎询价 |
询价 | ||
ST |
756 |
只做正品 |
询价 | ||||
ST/意法半导体 |
2023+ |
D2PAK-3 |
6000 |
原装正品现货、支持第三方检验、终端BOM表可配单提供 |
询价 | ||
ST/意法半导体 |
23+ |
D2PAK-3 |
12820 |
正规渠道,只有原装! |
询价 | ||
ST/意法半导体 |
24+ |
D2PAK-3 |
10000 |
十年沉淀唯有原装 |
询价 | ||
ST/意法半导体 |
25+ |
D2PAK-3 |
10000 |
原装公司现货 |
询价 | ||
ST/意法半导体 |
23+ |
D2PAK-3 |
12700 |
买原装认准中赛美 |
询价 | ||
ST/意法半导体 |
21+ |
D2PAK-3 |
8860 |
只做原装,质量保证 |
询价 |
