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STGB30H60DLFB中文资料Trench gate field-stop IGBT, HB series 600 V, 30 A high speed数据手册ST规格书

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厂商型号

STGB30H60DLFB

功能描述

Trench gate field-stop IGBT, HB series 600 V, 30 A high speed

制造商

ST STMicroelectronics

中文名称

意法半导体 意法半导体集团

数据手册

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更新时间

2025-9-23 11:22:00

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STGB30H60DLFB规格书详情

描述 Description

These devices are IGBTs developed using an advanced proprietary trench gate and field stop structure. The device is part of the new \"HB\" series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of any frequency converter. Furthermore, a slightly positive VCE(sat)temperature coefficient and very tight parameter distribution result in safer paralleling operation.

特性 Features

• Designed for soft commutation only
• Maximum junction temperature: TJ= 175 °C
• High speed switching series
• Minimized tail current
• VCE(sat)= 1.55 V (typ.) @ IC= 30 A
• Low VFsoft recovery co-packaged diode
• Tight parameters distribution
• Safe paralleling
• Low thermal resistance
• Lead free package

技术参数

  • 制造商编号

    :STGB30H60DLFB

  • 生产厂家

    :ST

  • Package

    :D2PAK

  • Grade

    :Industrial

  • VCES_max(V)

    :600

  • PTOT_max(W)

    :260

  • Freewheeling diode

    :true

  • IC_max(@ Tc=100°C)(A)

    :30

  • IC_max(@ Tc=25°C)(A)

    :60

  • IF_max(@ Tc=100°C)(A)

    :30

  • IF_max(@ Tc=25°C)(A)

    :60

  • VCE(sat)_typ(V)

    :1.55

  • VF_typ(V)

    :1.4

  • Qg_typ(nC)

    :149

  • Eoff_typ(mJ)

    :0.29

供应商 型号 品牌 批号 封装 库存 备注 价格
ST/意法半导体
24+
D2PAK-3
6000
全新原装深圳仓库现货有单必成
询价
ST
2511
D2PAK
16900
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价
询价
ST
25+
D2PAK
16900
原装,请咨询
询价
ST/意法
23+
TO-263
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
24+
N/A
48000
一级代理-主营优势-实惠价格-不悔选择
询价
ST
23+
D2PAK
8000
只做原装现货
询价
ST/意法半导体
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
ST/意法半导体
24+
D2PAK-3
16900
原装现货,实单价优
询价
ST
22+
D2PAK
9000
原厂渠道,现货配单
询价
ST/意法半导体
23+
D2PAK-3
6000
我们只做原装正品,支持检测。
询价