Advanced Process Technology

Description These HEXFET ® Power MOSFET’s in a Dual SO-8 package utilize the lastest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of these HEXFET Power MOSFET’s are a 175°C junction operating temperature, fast switching speed and improved repe

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IRF

SIDE-LOOK PACKAGE PIN PHOTODIODE

Description The MID-7341C is a photodiode mounted in water clear plastic package and suitable for the variety wavelength. Features • High photo sensitivity • Low junction capacitance • High cut-off frequency • Fast switching time

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UOT

东贝光电

SMT Power Inductors

[Coilcraft] The MSS7341 series is ideal for applications requiring high power and high efficiency such as notebook computers, wireless phones, PDAs and other handheld products. It provides excellent current handling capability in a rugged, low cost part. These magnetically shielded power inducto

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ETCList of Unclassifed Manufacturers

未分类制造商

HIGH ISOLATION VOLTAGE 6-PIN DIP OCMOS FET 1-ch OCMOS FET

DESCRIPTION The PS7341-1B and PS7341L-1B are solid state relays containing a GaAs LED on the light emitting side (input side) and normally close (N.C.) contact MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7341L-1B

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NEC

瑞萨