HEXFET® Power MOSFET

® Isolated Package ® High Voitage Isolation= 2.5KVRMS ® ® Sink to Lead Creepage Dist.= 4.8mm ® Dynamic dv/dt Rating ® Low Thermal Resistance Description Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized dev

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IRF

Multi-Message Single-Chip Voice Record & Playback Devices

GENERAL DESCRIPTION The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds,

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WINBOND

华邦电子

Multi-Message Single-Chip Voice Record&Playback Devices

GENERAL DESCRIPTION The Winbond® ISD1700A ChipCorder® Series is a high quality, fully integrated, single-chip multi message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in rangesfrom 26 seconds to 120 seconds,

文件：360.05 Kbytes 页数：31 Pages

WINBOND

华邦电子

Multi-Message Single-Chip Voice Record & Playback Devices

GENERAL DESCRIPTION The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds,

文件：356.32 Kbytes 页数：24 Pages

WINBOND

华邦电子