丝印：IPQ；Package：SMAJ；Transient Voltage Suppressor Diode Series

文件：350.04 Kbytes 页数：5 Pages

Bourns

伯恩斯

丝印：60R010S7；Package：PG-HDSOP-22；600V CoolMOSª SJ S7 Power Device

Features • CoolMOS™ S7 technology enables 10mW RDS(on) in the smallest footprint • Optimized price performance in low frequency switching applications • High pulse current capability • Kelvin Source pin improves switching performance at high current • QDPAK bottom side cooling package is MSL1

文件：1.37534 Mbytes 页数：14 Pages

Infineon

英飞凌

丝印：60A010S7；Package：PG-HDSOP-22；600V CoolMOSª SJ S7A Power Device

Features • Optimized for low switching frequency in high-end applications (circuit breakers and diode paralleling/replacement in bridge rectifiers). • S7A technology enables best in class RDS(on) in smallest footprint. • Kelvin Source pin improves switching performance at high current. • QDPA

文件：1.54137 Mbytes 页数：14 Pages

Infineon

英飞凌

丝印：60R017S7；Package：PG-HDSOP-22；600V CoolMOSª SJ S7 Power Device

Features • CoolMOS™ S7 technology enables 17mW RDS(on) in the smallest footprint • Optimized price performance in low frequency switching applications • High pulse current capability • Kelvin Source pin improves switching performance at high current • QDPAK bottom side cooling package is MSL1

文件：1.37862 Mbytes 页数：14 Pages

Infineon

英飞凌

丝印：60A017S7；Package：PG-HDSOP-22；600V CoolMOSª SJ S7A Power Device

Features • Optimized for low switching frequency in high-end applications (circuit breakers and diode paralleling/replacement in bridge rectifiers). • S7A technology enables best in class RDS(on) in smallest footprint. • Kelvin Source pin improves switching performance at high current. • QDPA

文件：1.54345 Mbytes 页数：14 Pages

Infineon

英飞凌

丝印：60R040S7；Package：PG-HDSOP-22；600V CoolMOSª SJ S7 Power Device

Features • CoolMOS™ S7 technology enables 40mW RDS(on) in the smallest footprint • Optimized price performance in low frequency switching applications • High pulse current capability • Kelvin Source pin improves switching performance at high current • QDPAK bottom side cooling package is MSL1

文件：1.38349 Mbytes 页数：14 Pages

Infineon

英飞凌

丝印：60A040S7；Package：PG-HDSOP-22；600V CoolMOSª SJ S7A Power Device

Features • Optimized for low switching frequency in high-end applications (circuit breakers and diode paralleling/replacement in bridge rectifiers). • S7A technology enables best in class RDS(on) in smallest footprint. • Kelvin Source pin improves switching performance at high current. • QDPA

文件：1.55093 Mbytes 页数：14 Pages

Infineon

英飞凌

丝印：60I010S7；Package：PG-HDSOP-22；MOSFET 600V CoolMOSª SJ S7A Power Device

Features • Optimized price performance in low-frequency switching applications • High pulse current capability • Seamless diagnostics at the lowest system cost • Temperature sense feature for protection and optimized thermal device utilization cost Benefits • Reduction of external sensing

文件：1.40117 Mbytes 页数：15 Pages

Infineon

英飞凌

丝印：60T010S7；Package：PG-HDSOP-22；MOSFET 600V CoolMOSª SJ S7A Power Device

Features • CoolMOS™ S7A technology enables lowest RDS(on) and high pulse current capability in the smallest footprint • Optimized price performance in low-frequency switching applications • Seamless diagnostics at lowest system cost • Temperature sense feature for protection and optimized the

文件：1.61527 Mbytes 页数：16 Pages

Infineon

英飞凌

丝印：60I017S7；Package：PG-HDSOP-22；MOSFET 600V CoolMOSª SJ S7 Power Device

Features • Optimized price performance in low-frequency switching applications • High pulse current capability • Seamless diagnostics at the lowest system cost • Temperature sense feature for protection and optimized thermal device utilization cost Benefits • Reduction of external sensing

文件：1.35763 Mbytes 页数：15 Pages

Infineon

英飞凌