丝印：873；Package：16Ld2.6x1.8UTQFN；Buck PWM Controller with Internal Compensation and External Reference Tracking

文件：835.24 Kbytes 页数：17 Pages

RENESAS

瑞萨

丝印：87321AIL；Package：SOIC；÷1, ÷2 Differential-TO-LVPECL Clock Generator

FEATURES • One differential LVPECL output • One CLK, nCLK input pair • CLK, nCLK pair can accept the following differential input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL • Maximum clock input frequency: 700MHz • Translates any single ended input signal (LVCMOS, LVTTL, GTL) to LVPECL levels

文件：521.919 Kbytes 页数：19 Pages

RENESAS

瑞萨

丝印：87321AIL；Package：SOIC；÷1, ÷2 Differential-TO-LVPECL Clock Generator

FEATURES • One differential LVPECL output • One CLK, nCLK input pair • CLK, nCLK pair can accept the following differential input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL • Maximum clock input frequency: 700MHz • Translates any single ended input signal (LVCMOS, LVTTL, GTL) to LVPECL levels

文件：521.919 Kbytes 页数：19 Pages

RENESAS

瑞萨

丝印：87312E；Package：VSON；Dual 30-V N-Channel NexFET™ Power MOSFETs

1FEATURES • Common Source Connection • Ultra Low Drain to Drain On-Resistance • Space Saving SON 3.3 x 3.3mm Plastic Package • Optimized for 5V Gate Drive • Low Thermal Resistance • Avalanche Rated • Pb Free Terminal Plating • RoHS Compliant • Halogen Free APPLICATIONS • Adaptor/USB

文件：536.83 Kbytes 页数：15 Pages

TI

德州仪器

丝印：87312E；Package：VSON；Dual 30-V N-Channel NexFET™ Power MOSFETs

1FEATURES • Common Source Connection • Ultra Low Drain to Drain On-Resistance • Space Saving SON 3.3 x 3.3mm Plastic Package • Optimized for 5V Gate Drive • Low Thermal Resistance • Avalanche Rated • Pb Free Terminal Plating • RoHS Compliant • Halogen Free APPLICATIONS • Adaptor/USB

文件：536.83 Kbytes 页数：15 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.9 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.48 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.48 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.9 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 90% System Efficiency at 15 A • Up to 20-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package •

文件：637.9 Kbytes 页数：24 Pages

TI

德州仪器