丝印：87353D；Package：LSON-CLIP；CSD87353Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• VIN up to 27 V • Half-Bridge Power Block • 95% System Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoH

文件：781.08 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87353D；Package：LSON-CLIP(DQY)；CSD87353Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• VIN up to 27 V • Half-Bridge Power Block • 95% System Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoH

文件：781.5 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87353D；Package：LSON-CLIP(DQY)；CSD87353Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• VIN up to 27 V • Half-Bridge Power Block • 95% System Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoH

文件：781.5 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87353D；Package：LSON-CLIP；CSD87353Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• VIN up to 27 V • Half-Bridge Power Block • 95% System Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoH

文件：781.08 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87353D；Package：LSON-CLIP；CSD87353Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• VIN up to 27 V • Half-Bridge Power Block • 95% System Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoH

文件：781.08 Kbytes 页数：27 Pages

TI

德州仪器