丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器