丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器