丝印：8738；Package：FC-16；High efficiency, low noise, sound volume, MultI-Level AGC 8

文件：1.60789 Mbytes 页数：28 Pages

AWINIC

艾为电子

丝印：87381P；Package：PTAB；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：595.91 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87381P；Package：PTAB(MPC)；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：599.41 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87381P；Package：PTAB(MPC)；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：599.41 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87381P；Package：PTAB；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：595.91 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87381P；Package：PTAB(MPC)；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：599.41 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87381P；Package：PTAB(MPC)；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：599.41 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87381P；Package：PTAB；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：595.91 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87381P；Package：PTAB；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：595.91 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87381P；Package：PTAB(MPC)；CSD87381P Synchronous Buck NexFET™ Power Block II

1 Features 1• Half-Bridge Power Block • 90% System Efficiency at 10 A • Up to 15 A Operation • High Density – 3 × 2.5 mm LGA Footprint • Double Side Cooling Capability • Ultra-Low Profile – 0.48 mm Max • Optimized for 5 V Gate Drive • Low Switching Losses • Low Inductance Package • R

文件：599.41 Kbytes 页数：25 Pages

TI

德州仪器