EasyPACK??module with CoolSiC??Trench MOSFET and PressFIT / NTC / TIM

Features • Electrical features - VDSS = 1200 V - IDN = 100 A / IDRM = 200 A - High current density - Low switching losses • Mechanical features - Rugged mounting due to integrated mounting clamps - Integrated NTC temperature sensor - PressFIT contact technology - Pre-applied thermal inte

文件：1.41041 Mbytes 页数：22 Pages

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EasyPACK??module with CoolSiC??Trench MOSFET and PressFIT / NTC / TIM

Features • Electrical features - VDSS = 1200 V - IDN = 100 A / IDRM = 200 A - High current density - Low switching losses • Mechanical features - Rugged mounting due to integrated mounting clamps - Integrated NTC temperature sensor - PressFIT contact technology - Pre-applied thermal inte

文件：1.41041 Mbytes 页数：22 Pages

INFINEON

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EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC

文件：825.69 Kbytes 页数：11 Pages

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EasyPACK module with Trench/Fieldstopp IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC

文件：665.57 Kbytes 页数：10 Pages

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EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC

文件：825.69 Kbytes 页数：11 Pages

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EasyPACK Modul mit aktiver

文件：991.93 Kbytes 页数：14 Pages

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EasyPACK??Modul mit CoolSiC??Trench MOSFET und PressFIT / NTC

文件：665.61 Kbytes 页数：11 Pages

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3-Level-Applikationen

文件：859.94 Kbytes 页数：15 Pages

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3-Level-Applikationen

文件：859.94 Kbytes 页数：15 Pages

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EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC

文件：836.32 Kbytes 页数：11 Pages

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