Final datasheet EasyPACK™ module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and PressFIT / NTC

Features • Electrical features - VCES = 1200 V - IC nom = 340 A / ICRM = 680 A - Ultra fast IGBT chips - Low inductive design - Low switching losses - Low VCE,sat - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - 3.2 kV AC 1 min

文件：1.34096 Mbytes 页数：24 Pages

Infineon

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EasyPACK™ module

Features • Electrical features - VCES = 1200 V - IC nom = 340 A / ICRM = 680 A - Ultra fast IGBT chips - Low inductive design - Low switching losses - Low VCE,sat - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - 3.2 kV AC 1 min

文件：1.34093 Mbytes 页数：24 Pages

Infineon

英飞凌

EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC

Features • Electrical features - VCES = 1200 V - IC nom = 200 A / ICRM = 400 A - Increased DC-link voltage - High current density - Low switching losses - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - High current pin - Integr

文件：1.40673 Mbytes 页数：31 Pages

Infineon

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EasyPACK??module with TRENCHSTOP??5 and Emitter Controlled 3 diode and PressFIT / NTC

Features • Electrical features - VCES = 650 V - IC nom = 200 A / ICRM = 400 A - Low switching losses • Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - PressFIT contact technology - Integrated NTC temperature sensor - High power density Potential appl

文件：869.67 Kbytes 页数：22 Pages

Infineon

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EconoPACK™4 module with active Neutral Point Clamp 2 topology and PressFIT / NTC

Electrical Features • Extended Operation Temperature Tvj op • Low Switching Losses • Low VCEsat • Trench IGBT 4 • Tvj op = 150°C • VCEsat with positive Temperature Coefficient Mechanical Features • Isolated Base Plate • Compact design • PressFIT Contact Technology • Standard Housing

文件：1.14971 Mbytes 页数：14 Pages

Infineon

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qEconoPACK™4 module with active

Electrical Features • Extended operating temperature Tvj op • Low switching losses • Low VCEsat • Tvj op = 150°C • Trench IGBT 4 • VCEsat with positive temperature coefficient Mechanical Features • Isolated base plate • Compact design • PressFIT contact technology • Standard housing

文件：971.21 Kbytes 页数：14 Pages

Infineon

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EasyPACK™ module with active Neutral Point Clamp 2 topology and PressFIT / NTC

Features • Electrical features - VCES = 1200 V - IC nom = 500 A / ICRM = 1000 A - Ultra fast IGBT chips - Low inductive design - Low switching losses - Low VCE,sat - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - 3.2 kV AC 1 mi

文件：2.00804 Mbytes 页数：20 Pages

Infineon

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EasyPACK™ module with TRENCHSTOP™ IGBT7 and CoolSiC™ Schottky diode and PressFIT / NTC

Features • Electrical features - VCES = 950 V - IC nom = 600 A / ICRM = 800 A - CoolSiCTM Schottky diode gen 5 - TRENCHSTOPTM IGBT7 - Tvj,op = 150°C • Mechanical features - Package with CTI > 400 - PressFIT contact technology - Integrated NTC temperature sensor

文件：1.39142 Mbytes 页数：28 Pages

Infineon

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EasyPACK™ 2B module with CoolSiC™ Trench MOSFET and PressFIT / NTC

Features • Electrical features - VDSS = 2000 V - IDN = 100 A / IDRM = 200 A - Overload operation up to 175°C - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - AlN substrate with low thermal resistance - High creepage and clearance

文件：1.22643 Mbytes 页数：27 Pages

Infineon

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EasyPACK??module with CoolSiC??Trench MOSFET and PressFIT / NTC / TIM

Features • Electrical features - VDSS = 1200 V - IDN = 100 A / IDRM = 200 A - High current density - Low switching losses • Mechanical features - Rugged mounting due to integrated mounting clamps - Integrated NTC temperature sensor - PressFIT contact technology - Pre-applied thermal inte

文件：1.41041 Mbytes 页数：22 Pages

Infineon

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