EasyPACK??module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC

Features • Electrical features - VCES = 650 V - IC nom = 100 A / ICRM = 200 A - Increased blocking voltage capability up to 650 V - Low inductive design - Low switching losses - Low VCE,sat • Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - PressFIT c

文件：790.53 Kbytes 页数：22 Pages

Infineon

英飞凌

EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC / TIM

Features • Electrical features - VDSS = 1200 V - IDN = 75 A / IDRM = 150 A - High current density - Low switching losses • Mechanical features - Rugged mounting due to integrated mounting clamps - Integrated NTC temperature sensor - PressFIT contact technology - Pre-applied thermal inter

文件：939.75 Kbytes 页数：23 Pages

Infineon

英飞凌

EasyPACK??module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC

Features • Electrical features - VCES = 650 V - IC nom = 150 A / ICRM = 300 A - Increased blocking voltage capability up to 650 V - Low inductive design - Low switching losses - Low VCE,sat • Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - PressFIT c

文件：821.79 Kbytes 页数：22 Pages

Infineon

英飞凌

EasyPACK™ module with TRENCHSTOP™ IGBT H3 and emitter controlled 7 diode and PressFIT / NTC

Features • Electrical features - VCES = 1200 V - IC nom = 225 A / ICRM = 450 A - Low switching losses - High-speed IGBT H3 • Mechanical features - Compact design - PressFIT contact technology - Integrated NTC temperature sensor - High power density

文件：942.82 Kbytes 页数：21 Pages

Infineon

英飞凌

3-Level-Applikationen

Electrical Features • Extended operating temperature Tvj op • Low switching losses • Low Vcesat • Unbeatable robustness • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features • Isolated base plate • Standard housing • Pre-applied Thermal Interface Material

文件：635.51 Kbytes 页数：10 Pages

Infineon

英飞凌

3-Level-Applikationen

Electrical Features • Extended operating temperature Tvj op • Low switching losses • Low VCEsat • Unbeatable robustness • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features • Isolated base plate • Standard housing • Pre-applied Thermal Interface Material

文件：632.82 Kbytes 页数：10 Pages

Infineon

英飞凌

3-Level-Applikationen

Electrical Features • Extended operating temperature Tvj op • Low switching losses • Low Vcesat • Unbeatable robustness • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features • Isolated base plate • Standard housing • Pre-applied Thermal Interface Material

文件：635.51 Kbytes 页数：10 Pages

Infineon

英飞凌

3-Level-Applikationen

Electrical Features • Extended operating temperature Tvj op • Low switching losses • Low VCEsat • Unbeatable robustness • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features • Isolated base plate • Standard housing • Pre-applied Thermal Interface Material

文件：632.82 Kbytes 页数：10 Pages

Infineon

英飞凌

EconoPACK™4 module with active Neutral Point Clamp 2 topology and PressFIT / NTC

Electrical Features • Extended Operation Temperature Tvj op • Low Switching Losses • Low VCEsat • Trench IGBT 4 • Tvj op = 150°C • VCEsat with positive Temperature Coefficient Mechanical Features • Isolated Base Plate • Compact design • PressFIT Contact Technology • Standard Housing

文件：1.13867 Mbytes 页数：14 Pages

Infineon

英飞凌

EasyPACK™ module

Features • Electrical features - VCES = 1200 V - IC nom = 340 A / ICRM = 680 A - Ultra fast IGBT chips - Low inductive design - Low switching losses - Low VCE,sat - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - 3.2 kV AC 1 min

文件：1.34093 Mbytes 页数：24 Pages

Infineon

英飞凌