FF200R12MT4中文资料IGBT模块数据手册Infineon规格书

描述 Description

EconoDUAL™ 2 1200V dual IGBT module with fast trench/fieldstop IGBT4, Emitter Controlled 4 diode and NTC

特性 Features

·High Short Circuit Capability
·Self Limiting Short Circuit Current
·Low Switching Losses
·High Power Density
·Isolated Base Plate
·Standard Housing

应用 Application

   Please also find our EiceDRIVER™ HV Gate Driver Family. Including our EiceDRIVER™ Enhanced Driver ICs for your easy and reliable design.The 1EDI60I12AF EiceDRIVER™ compact is a fast and powerful Gate Driver suitable for your IGBT Module applications. (Evalboard available)FF200R12MT4Data Sheet (846 KB, EN/CN)EN/DEEN/JAParametricFF200R12MT4Configuration DualIC(nom) / IF(nom)  200.0A VCE(sat)(Tvj=25°C typ) 1.75V VF(Tvj=25°C typ) 1.7V Housing EconoDUAL™ 2Dimensions(width) 45.0mm Dimensions(length) 122.0mm Data SheetTitleSizeDateVersionFF200R12MT4 (chinese/english)EN/CNEN/DEEN/JA846 KB02 十二月 201302_05Product BrochureTitleSizeDateVersion1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIndustrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02Soldering of Econo and Easy ModulesEN194 KB10 二月 2014评估板_AN2007_05_2ED300E17_SFOCNEN1,023 KB04 十一月 201501_01利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009等效热路模型CNEN500 KB25 十一月 2013如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionEconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power ModulesEN440 KB27 四月 201607_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00„Econo“ my improvement in inverter-converter-moduldesignEN90 KB07 二月 2014IGBT Module technology state of the art and future evolutionsEN37 KB07 二月 2014On the loss - softness trade-off: Are different chip versions needed for softness-improvement?EN731 KB31 一月 20111200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current ModulesEN141 KB07 二月 2014Improving Efficiency in AC drives: Comparison of Topologies and Device TechnologiesEN892 KB31 五月 2014Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Saving money: SiC in UPS applicationsEN759 KB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00销售产品名称FF200R12MT4OPNFF200R12MT4BOMA1产品状态discontinued在线订购封装名称AG-ECONOD-2无铅产品no无卤no通过无铅认证yes包装规格14包装类型TRAY评估板评估板系列描述状态2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.·For equipping EiceDRIVER™ 2ED300C17-S / -ST

简介

FF200R12MT4属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FF200R12MT4晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。