丝印：97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.

文件：665.23 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.

文件：665.23 Kbytes 页数：23 Pages

TI

德州仪器