CSD97376Q4M.B芯片代码丝印对应型号-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
CSD97376Q4M	文件：665.23 Kbytes Page：23 Pages	丝印：97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3. 文件：665.23 Kbytes 页数：23 Pages	TI 德州仪器	TI
CSD97376Q4M.B	文件：665.23 Kbytes Page：23 Pages	丝印：97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3. 文件：665.23 Kbytes 页数：23 Pages	TI 德州仪器	TI

更多97376M供应商更新时间2025-11-4 10:59:00