CSD97376Q4M.B中文资料德州仪器数据手册PDF规格书

1 Features

1• 90% System Efficiency at 15 A

• Max Rated Continuous Current 20 A, Peak 45 A

• High-Frequency Operation (up to 2 MHz)

• High-Density SON 3.5-mm x 4.5-mm Footprint

• Ultra-Low Inductance Package

• System Optimized PCB Footprint

• Ultra-Low Quiescent (ULQ) Current Mode

• 3.3-V and 5-V PWM Signal Compatible

• Diode Emulation Mode with FCCM

• Input Voltages up to 24 V

• Tri-State PWM Input

• Integrated Bootstrap Diode

• Shoot-Through Protection

• RoHS Compliant – Lead-Free Terminal Plating

• Halogen Free

2 Applications

• Ultrabook/Notebook DC/DC Converters

• Multiphase Vcore and DDR Solutions

• Point-of-Load Synchronous Buck in Networking,

Telecom, and Computing Systems

3 Description

The CSD97376Q4M NexFET™ power stage is a

highly optimized design for use in a high-power, highdensity

synchronous buck converter. This product

integrates the driver IC and NexFET technology to

complete the power stage switching function. The

driver IC has a built-in selectable diode emulation

function that enables DCM operation to improve light

load efficiency. In addition, the driver IC supports

ULQ mode that enables Connected Standby for

Windows™ 8. With the PWM input in tri-state,

quiescent current is reduced to 130 μA with

immediate response. When SKIP# is held at tri-state,

the current is reduced to 8 μA (typically 20 μs is

required to resume switching). This combination

produces a high-current, high-efficiency, and highspeed

switching device in a small 3.5-mm × 4.5-mm

outline package. In addition, the PCB footprint has

been optimized to help reduce design time and

simplify the completion of the overall system design.