丝印：97394M；Package：VSON-CLIP；CSD97394Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 × 4.5 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

文件：587.36 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97394M；Package：VSON-CLIP；CSD97394Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 × 4.5 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

文件：587.36 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97394M；Package：VSON-CLIP；CSD97394Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 × 4.5 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

文件：587.36 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97394M；Package：VSON-CLIP；CSD97394Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 × 4.5 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

文件：587.36 Kbytes 页数：21 Pages

TI

德州仪器