丝印：97395M；Package：VSON-CLIP；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：592.06 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP(DPC)；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：595.6 Kbytes 页数：22 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：592.06 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP(DPC)；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：595.6 Kbytes 页数：22 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：592.06 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：592.06 Kbytes 页数：21 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP(DPC)；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：595.6 Kbytes 页数：22 Pages

TI

德州仪器

丝印：97395M；Package：VSON-CLIP；CSD97395Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：592.06 Kbytes 页数：21 Pages

TI

德州仪器