丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：553.15 Kbytes 页数：19 Pages

TI

德州仪器

丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：553.15 Kbytes 页数：19 Pages

TI

德州仪器

丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：553.15 Kbytes 页数：19 Pages

TI

德州仪器

丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：553.15 Kbytes 页数：19 Pages

TI

德州仪器

丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod

文件：553.15 Kbytes 页数：19 Pages

TI

德州仪器