CSD97396Q4M集成电路（IC）的全半桥驱动器规格书PDF中文资料

CSD97396Q4M属于集成电路（IC）的全半桥驱动器。由德州仪器制造生产的CSD97396Q4M全半桥驱动器器件属于电桥驱动器电源管理集成电路 (PMIC) 系列，包含两个或多个功率晶体管，以及在外部器件控制下将其用作开关所需的电路。这些晶体管通常在内部配置为成对串联连接（称为半桥），因而任意指定晶体管对之间的结点都可以连接至两个电源轨中的任一个。这类器件常用于将控制器件（如微控制器）提供的低电平信号转换为操作执行器（如步进电机或无刷电机）所需的较大功率信号。

1 Features

1• Over 93% System Efficiency at 15 A

• Max Rated Continuous Current 30 A, Peak 65 A

• High Frequency Operation (up to 2 MHz)

• High Density – SON 3.5 mm × 4.5 mm Footprint

• Ultra-Low Inductance Package

• System-Optimized PCB Footprint

• Ultra-Low Quiescent (ULQ) Current Mode

• 3.3 V and 5 V PWM Signal Compatible

• Diode Emulation Mode With FCCM

• Input Voltages up to 24 V

• Tri-State PWM Input

• Integrated Bootstrap Diode

• Shoot-Through Protection

• RoHS Compliant – Lead Free Terminal Plating

• Halogen Free

2 Applications

• Ultrabook/Notebook DC/DC Converters

• Multiphase Vcore and DDR Solutions

• Point-of-Load Synchronous Buck in Networking,

Telecom, and Computing Systems

3 Description

The CSD97396Q4M NexFET™ Power Stage is a

highly optimized design for use in a high-power, high-

density synchronous buck converter. This product

integrates the driver IC and NexFET technology to

complete the power stage switching function. The driver IC has a built-in selectable diode emulation

function that enables DCM operation to improve light

load efficiency. In addition, the driver IC supports

ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state,

quiescent current is reduced to 130 μA, with

immediate response. When SKIP# is held at tri-state,

the current is reduced to 8 μA (typically 20 μs is

required to resume switching). This combination

produces a high current, high efficiency, and high

speed switching device in a small 3.5 × 4.5 mm

outline package. In addition, the PCB footprint is

optimized to help reduce design time and simplify the

completion of the overall system design.