首页 >CSD97396Q4M>规格书列表
| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
CSD97396Q4M | 丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：553.15 Kbytes 页数：19 Pages | TI 德州仪器 | TI | |
CSD97396Q4M | 丝印：97396M；Package：VSON-CLIP(DPC)；CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：556.52 Kbytes 页数：20 Pages | TI 德州仪器 | TI | |
CSD97396Q4M | Synchronous Buck NexFET Power Stage 文件：497.26 Kbytes 页数：20 Pages | TI 德州仪器 | TI | |
丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：553.15 Kbytes 页数：19 Pages | TI 德州仪器 | TI | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：556.52 Kbytes 页数：20 Pages | TI 德州仪器 | TI | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：556.52 Kbytes 页数：20 Pages | TI 德州仪器 | TI | ||
丝印：97396M；Package：VSON-CLIP(DPC)；CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：556.52 Kbytes 页数：20 Pages | TI 德州仪器 | TI | ||
丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：553.15 Kbytes 页数：19 Pages | TI 德州仪器 | TI | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：556.52 Kbytes 页数：20 Pages | TI 德州仪器 | TI | ||
丝印：97396M；Package：VSON-CLIP；CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod 文件：553.15 Kbytes 页数：19 Pages | TI 德州仪器 | TI |
产品属性
- 产品编号：
CSD97396Q4M
- 制造商：
Texas Instruments
- 类别：
集成电路（IC） > 全半桥驱动器
- 系列：
NexFET™
- 包装：
托盘
- 输出配置：
半桥
- 应用：
同步降压转换器
- 接口：
PWM
- 负载类型：
电感
- 技术：
功率 MOSFET
- 电流 - 输出/通道：
30A
- 电流 - 峰值输出：
65A
- 电压 - 供电：
4.5V ~ 5.5V
- 电压 - 负载：
4.5V ~ 24V
- 工作温度：
-40°C ~ 150°C（TJ）
- 特性：
自举电路，二极管仿真
- 故障保护：
击穿
- 安装类型：
表面贴装型
- 封装/外壳：
8-PowerVFDFN
- 供应商器件封装：
8-VSON（3.5x4.5）
- 描述：
IC NEXFET SYNC BUCK 8VSON
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
20+ |
VSON8 |
6000 |
原装正品公司现货假一赔十 |
询价 | ||
TI/德州仪器 |
21+ |
VSON-8(3.5x4.5) |
10000 |
原装正品 |
询价 | ||
TI(德州仪器) |
24+ |
VSON8 |
25648 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
询价 | ||
TI |
2024+ |
N/A |
70000 |
柒号只做原装 现货价秒杀全网 |
询价 | ||
TI |
23+ |
VSON-CL |
8560 |
受权代理!全新原装现货特价热卖! |
询价 | ||
TI |
三年内 |
1983 |
只做原装正品 |
询价 | |||
TI |
16+ |
VSON-CLIP |
10000 |
原装正品 |
询价 | ||
TI |
20+ |
VSOP8 |
53650 |
TI原装主营-可开原型号增税票 |
询价 | ||
TI |
24+ |
VSOP8 |
65300 |
一级代理/放心采购 |
询价 | ||
TI/德州仪器 |
23+ |
VSON8 |
24981 |
原装正品代理渠道价格优势 |
询价 |
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