丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87334D；Package：VSON-CLIP；CSD87334Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Optimized for High-Duty Cycle • Up to 24 Vin • 96.1% System Efficiency at 12 A • 1.6-W PLoss at 12 A • Up to 20-A Operation • High-Frequency Operation (up to 1.5 MHz) • High-Density SON 3.3 mm × 3.3 mm Footprint • Optimized for 5-V Gate Drive •

文件：973.41 Kbytes 页数：24 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87335D；Package：LSON-CLIP；CSD87335Q3D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • Up to 27-V VIN • 93.5% System Efficiency at 15 A • Up to 25-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low Inductance Package

文件：789.71 Kbytes 页数：25 Pages

TI

德州仪器

丝印：87350D；Package：LSON-CLIP(DQY)；CSD87350Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • 90% system Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoHS Compliant • Hal

文件：781.69 Kbytes 页数：27 Pages

TI

德州仪器

丝印：87350D；Package：LSON-CLIP(DQY)；CSD87350Q5D Synchronous Buck NexFET™ Power Block

1 Features 1• Half-Bridge Power Block • 90% system Efficiency at 25 A • Up to 40-A Operation • High-Frequency Operation (Up to 1.5 MHz) • High-Density SON 5-mm × 6-mm Footprint • Optimized for 5-V Gate Drive • Low-Switching Losses • Ultra-Low-Inductance Package • RoHS Compliant • Hal

文件：781.69 Kbytes 页数：27 Pages

TI

德州仪器