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BCR183

Marking:WMs;Package:SOT23;PNP Silicon Digital Transistor

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

BCR183S

Marking:WMs;Package:SOT363;PNP Silicon Digital Transistor

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

BCR183U

Marking:WMs;Package:SC74;PNP Silicon Digital Transistor

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

BCR183W

Marking:WMs;Package:SOT323;PNP Silicon Digital Transistor

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

WMS30N050S

Marking:WMS30N050S;Package:TO252;N-Channel Silicon MOSFET

Generaldescription WMS30N050Sisahighperformance logiclevelN-channelMOSFETinTO252 package,whichutilizesadvancedTrench MOSFETtechnologytoprovidelowRDS(on) andgatecharge.Itisdesignedandqualified inawiderangeofindustrialandconsumer applications. Featuresand

WEENWeEn Semiconductors

瑞能半导体瑞能半导体科技股份有限公司

WMSC008H12B1P

Marking:WMSC008H12B1P;Package:WeEnPACK-B1;N-Channel Silicon Carbide MOSFET Module

Generaldescription WeEnPACK-B1modulewithWeEn1200V Gen2SiCMOSFETandPressFitpintype. IntergratedwithNTCtemperaturesensor. Featuresandbenefits •Halfbridgetopology •PressFitpinstechnology •LowRDSon •LowSwitchingLosses •LowQgandCrss •LowInductiveDesign

WEENWeEn Semiconductors

瑞能半导体瑞能半导体科技股份有限公司

WMSC010H12B1P

Marking:WMSC010H12B1P;Package:WeEnPACK-B1;N-Channel Silicon Carbide MOSFET Module

Generaldescription WeEnPACK-B1modulewithWeEn1200V Gen2SiCMOSFETandPressFitpintype. IntergratedwithNTCtemperaturesensor Featuresandbenefits •Halfbridgetopology •PressFitpinstechnology •LowRDSon •LowSwitchingLosses •LowQgandCrss •LowInductiveDesign A

WEENWeEn Semiconductors

瑞能半导体瑞能半导体科技股份有限公司

WMSC020H12B1P

Marking:WMSC020H12B1P;Package:WeEnPACK-B1;N-Channel Silicon Carbide MOSFET Module

Generaldescription WeEnPACK-B1modulewithWeEn1200V Gen2SiCMOSFETandPressFitpintype. IntergratedwithNTCtemperaturesensor. Featuresandbenefits •Halfbridgetopology •PressFitpinstechnology •LowRDSon •LowSwitchingLosses •LowQgandCrss •LowInductiveDesign

WEENWeEn Semiconductors

瑞能半导体瑞能半导体科技股份有限公司

WMSC040H12B1P

Marking:WMSC040H12B1P;Package:WeEnPACK-B1;N-Channel Silicon Carbide MOSFET Module

Generaldescription WeEnPACK-B1modulewithWeEn1200V Gen2SiCMOSFETandPressFitpintype. IntergratedwithNTCtemperaturesensor. Featuresandbenefits •Halfbridgetopology •PressFitpinstechnology •LowRDSon •LowSwitchingLosses •LowQgandCrss •LowInductiveDesign

WEENWeEn Semiconductors

瑞能半导体瑞能半导体科技股份有限公司

详细参数

  • 型号:

    WMS

  • 制造商:

    WEDC

  • 制造商全称:

    White Electronic Designs Corporation

  • 功能描述:

    128Kx8 MONOLITHIC SRAM, SMD 5962-96691

供应商型号品牌批号封装库存备注价格
INFINEON
22+
SOT-23
8000
终端可免费供样,支持BOM配单
询价
INFINEON
23+
SOT-23
8000
只做原装现货
询价
INFINEON
23+
SOT-23
7000
询价
NuvotonTechnologyCorpora
24+
8-SOIC
196
询价
WINBOND
0318+
SSOP
1712
自己公司全新库存绝对有货
询价
WEDC
24+
SOJ32
5000
只做原装公司现货
询价
WEDC
23+
DIP钢面
8560
受权代理!全新原装现货特价热卖!
询价
WEDC
18+
SOJ32
85600
保证进口原装可开17%增值税发票
询价
WINBOND
23+
MSOP
999999
原装正品现货量大可订货
询价
EDI
24+
CDIP
200
进口原装正品优势供应
询价
更多WMS供应商 更新时间2025-7-25 14:00:00