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PBSS5330PA

30 V, 3 A PNP low VCEsat transistor

Generaldescription PNPlowVCEsatBreakthroughInSmallSignal(BISS)transistor,encapsulatedinanultrathinSOT1061leadlesssmallSurface-MountedDevice(SMD)plasticpackagewithmediumpowercapability. NPNcomplement:PBSS4330PA. Featuresandbenefits •Lowcollector-emittersaturatio

ETC

ETC

PBSS5330PA

丝印:AJ;Package:DFN2020-3;30 V, 3 A PNP low VCEsat (BISS) transistor

1.Generaldescription PNPlowVCEsatBreakthroughInSmallSignal(BISS)transistor,encapsulatedinan ultrathinSOT1061leadlesssmallSurface-MountedDevice(SMD)plasticpackagewith mediumpowercapability. NPNcomplement:PBSS4330PA. 2.Featuresandbenefits •Lowcollector-emitter

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PBSS5330PA

30 V, 3 A PNP low VCEsat (BISS) transistor;

General description\nPNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.NPN complement: PBSS4330PA.Features and benefits\n• Low collector-emitter saturation voltage VCEsat\n• High collector current capability IC and ICM\n• Smaller required Printed-Circuit Board (PCB) area than for conventional transistors\n• Exposed heat sink for excellent thermal and electrical conductivity\n• Leadless small SMD plastic package with medium power capability

恩XP

恩XP

PBSS5330PAS

30 V, 3 A PNP low VCEsat (BISS) transistor;

General description\nPNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.NPN complement: PBSS4330PASFeatures and benefits\n• Low collector-emitter saturation voltage VCEsat\n• High collector current capability IC and ICM\n• High collector current gain (hFE) at high IC\n• High efficiency due to less heat generation\n• High temperature applications up to 175 °C\n• Reduced Printed-Circuit Board (PCB) area requirements\n• Leadless small SMD plastic package with soldarable side pads\n• Exposed heat sink for excellent thermal and electrical conductivity\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• AEC-Q101 qualified

恩XP

恩XP

PBSS5330PAS

30 V, 3 A PNP low VCEsat (BISS) transistor; • Low collector-emitter saturation voltage VCEsat\n• High collector current capability IC and ICM\n• High collector current gain (hFE) at high IC\n• High efficiency due to less heat generation\n• High temperature applications up to 175 °C\n• Reduced Printed-Circuit Board (PCB) area requirements\n• Leadless small SMD plastic package with soldarable side pads\n• Exposed heat sink for excellent thermal and electrical conductivity\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• AEC-Q101 qualified\n;

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.\n NPN complement: PBSS4330PAS\n

NexperiaNexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PBSS5330PAS

丝印:E2;Package:DFN2020D-3;30 V, 3 A PNP low VCEsat (BISS) transistor

Generaldescription PNPlowVCEsatBreakthroughInSmallSignal(BISS)transistor,encapsulatedinanultrathinDFN2020D-3(SOT1061D)leadlesssmallSurface-MountedDevice(SMD)plasticpackagewithmediumpowercapabilityandvisibleandsoldarablesidepads. NPNcomplement:PBSS4330PAS Featu

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PBSS5330X

30 V, 3 A PNP low VCEsat (BISS) transistor

DESCRIPTION PNPlowVCEsattransistorinaSOT89plasticpackage. FEATURES •SOT89(SC-62)package •Lowcollector-emittersaturationvoltageVCEsat •Highcollectorcurrentcapability:ICandICM •Higherefficiencyleadingtolessheatgeneration •Reducedprinted-circuitboardrequiremen

PHIPhilips Semiconductors

飞利浦荷兰皇家飞利浦

PHI

PBSS5330X

丝印:1S;Package:SOT89;30 V, 3 A PNP low VCEsat (BISS) transistor

FEATURES •SOT89(SC-62)package •Lowcollector-emittersaturationvoltageVCEsat •Highcollectorcurrentcapability:ICandICM •Higherefficiencyleadingtolessheatgeneration •Reducedprinted-circuitboardrequirements. APPLICATIONS •Powermanagement –DC/DCconverters –Supplylines

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PBSS5330PA_15

30 V, 3 A PNP low VCEsat (BISS) transistor

PHIPhilips Semiconductors

飞利浦荷兰皇家飞利浦

PHI

PBSS5330PAS_15

30 V, 3 A PNP low VCEsat (BISS) transistor

PHIPhilips Semiconductors

飞利浦荷兰皇家飞利浦

PHI

技术参数

  • Package name:

    DFN2020-3

  • Size (mm):

    2 x 2 x 0.65

  • Polarity:

    PNP

  • Ptot (mW):

    500

  • VCEO [max] (V):

    -30

  • IC [max] (mA):

    -3000

  • hFE [min]:

    200

  • hFE [max]:

    450

  • Tj [max] (°C):

    150

  • fT [min] (MHz):

    100

  • Automotive qualified:

    N

供应商型号品牌批号封装库存备注价格
NEXPERIA/安世
25+
原装
600000
NEXPERIA/安世全新特价PBSS5330PA即刻询购立享优惠#长期有排单订
询价
NEXPERIA/安世
21+
DFN-2020-3
60000
绝对原装正品现货,假一罚十
询价
恩XP
23+
NA
41462
专做原装正品,假一罚百!
询价
恩XP
21+
DFN
12588
原装正品,自己库存
询价
恩XP
2018+
DFN
55000
原装正品,诚信经营
询价
恩XP
20+
SMD
11520
特价全新原装公司现货
询价
NEXPERIA/安世
2447
DFN-2020-3
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
NEXPERIA/安世
21+
DFN-2020-3
10000
只做原装,一定有货,不止网上数量,量多可订货!
询价
恩XP
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
询价
恩XP
21+
SOT1061
6000
全新原装 现货 价优
询价
更多PBSS5330供应商 更新时间2025-7-29 16:33:00