Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.97323 Mbytes 页数：24 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.97323 Mbytes 页数：24 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.97323 Mbytes 页数：24 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

STANDARD SHAFT SEALS

DESCRIPTION The KBCW profile is a shaft seal composed of a single external metal cage with rubber grooves covering half of the outside of the cage, a primary sealing lip without a spring and an additional anti-pollution lip. APPLICATIONS All types of rotative applications Machine tool

文件：274.21 Kbytes 页数：4 Pages

FRANCEJOINT

TRIPLE-LIP SHAFT SEALS

DESCRIPTION The KBCWL3 profile is a shaft seal composed of a single external metal cage with rubber grooves covering half of the outside of the cage and a triple sealing lip. APPLICATIONS All types of rotative applications Agriculture Construction Transmission

文件：394.19 Kbytes 页数：4 Pages

FRANCEJOINT

For new installations, Bussmann recommends the 700 Volt FWP series fuse. The 600V fuses are supplied as replacements only.

文件：34.16 Kbytes 页数：1 Pages

COOPER