Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

OSRAM OSRAM OSTAR® Projection Compact, KB CULPM1.14

结构紧凑的光源设计，热点分离的焊盘设计能够提高散热性能，高电流芯片技术可以提高光学输出。

ams-OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.88163 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗