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GC1300

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1301

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1302

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1303

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1304

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1305

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1306

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1307

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1308

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

GC1309

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

文件:290.19 Kbytes 页数:4 Pages

Microsemi

美高森美

技术参数

  • Configuration:

    N channel

  • VDS:

    650V

  • Id at 25℃(max):

    30A

  • PD(max):

    96.1W

  • Vgs(th)typ(V):

    4V

  • RDS(on)(typ)(@10V):

    97mΩ

  • Qg(nC):

    68

  • Ciss:

    3100

  • Crss:

    24

供应商型号品牌批号封装库存备注价格
GC
23+
SOP8
8560
受权代理!全新原装现货特价热卖!
询价
MICROCHIP(美国微芯)
24+
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
Microchip
13689
只做正品
询价
MICROCHIP
23+
7300
专注配单,只做原装进口现货
询价
24+
N/A
58000
一级代理-主营优势-实惠价格-不悔选择
询价
GOODIX
21+
BGA
55
原装
询价
TEMIC
25+
SMD24P
3200
绝对原装自家现货!真实库存!欢迎来电!
询价
TEMIC
24+
SOP-24P
700
询价
TEMIC
2000
SSOP
2040
原装现货海量库存欢迎咨询
询价
TEMIC
23+
SSOP
12000
全新原装假一赔十
询价
更多GC1供应商 更新时间2025-10-6 8:04:00