| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Silicon Carbide Schottky Diode FEATURES · High Avalanche (UIS) Capability · Low Thermal Resistance · Extremely Fast Switching Speeds APPLICATIONS · Boost Diode in Power Factor Correction (PFC) · Motor Drives · Uninterruptible Power Supply (UPS) · Switched Mode Power Supply (SMPS) 文件：357.54 Kbytes 页数：3 Pages | ISC 无锡固电 | ISC | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per 文件：290.19 Kbytes 页数：4 Pages | Microsemi 美高森美 | Microsemi |
技术参数
- Configuration：
N channel
- VDS：
650V
- Id at 25℃(max)：
30A
- PD(max)：
96.1W
- Vgs(th)typ(V)：
4V
- RDS(on)(typ)(@10V)：
97mΩ
- Qg(nC)：
68
- Ciss：
3100
- Crss：
24
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
GC |
23+ |
SOP8 |
8560 |
受权代理!全新原装现货特价热卖! |
询价 | ||
MICROCHIP(美国微芯) |
24+ |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | |||
Microchip |
13689 |
只做正品 |
询价 | ||||
MICROCHIP |
23+ |
7300 |
专注配单,只做原装进口现货 |
询价 | |||
24+ |
N/A |
58000 |
一级代理-主营优势-实惠价格-不悔选择 |
询价 | |||
GOODIX |
21+ |
BGA |
55 |
原装 |
询价 | ||
TEMIC |
24+ |
SOP-24P |
700 |
询价 | |||
TEMIC |
2000 |
SSOP |
2040 |
原装现货海量库存欢迎咨询 |
询价 | ||
TEMIC |
23+ |
SSOP |
12000 |
全新原装假一赔十 |
询价 | ||
AT/T |
22+ |
SSOP24 |
5000 |
全新原装现货!自家库存! |
询价 |
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