ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

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MICROSEMI

美高森美

ENHANCED PERFORMANCE SURFACE MOUNT EPSM?줙yperabrupt Varactor Diodes TM

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MICROSEMI

美高森美

Varactors (Surface Mount)

Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wirele

Microchip

微芯科技

TMOS POWER FET 75 AMPERES

The D2PAK package has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(on) capabilities. This advanced high–cell density HDTMOS power FET is des

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MOTOROLA

摩托罗拉

TMOS POWER FET 75 AMPERES 30 VOLTS RDS(on) = 0.0065 OHM

This advanced high–cell density HDTMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplie

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MOTOROLA

摩托罗拉

Noise shaping filter DAC

GENERAL DESCRIPTION The TDA1306T is a dual CMOS digital-to-analog converter with up-sampling filter and noise shaper. The combination of oversampling up to 4fs, noise shaping and continuous calibration conversion ensures that only simple 1st-order analog post-filtering is required. FEATURES Gen

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PHI

PHI