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DS34T108GN集成电路(IC)的专用IC规格书PDF中文资料

厂商型号 |
DS34T108GN |
参数属性 | DS34T108GN 封装/外壳为484-BGA 裸露焊盘;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为集成电路(IC)的专用IC;DS34T108GN应用范围:数据传输;产品描述:IC TDM 484HSBGA |
功能描述 | Single/Dual/Quad/Octal TDM-Over-Packet Chip |
封装外壳 | 484-BGA 裸露焊盘 |
文件大小 |
803.77 Kbytes |
页面数量 |
74 页 |
生产厂商 | Maxim Integrated Products |
企业简称 |
MAXIM【美信】 |
中文名称 | 美信半导体官网 |
原厂标识 | |
数据手册 | |
更新时间 | 2025-8-1 23:00:00 |
人工找货 | DS34T108GN价格和库存,欢迎联系客服免费人工找货 |
DS34T108GN规格书详情
General Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.
特性 Features
♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC
♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
♦ 64 Independent Bundles/Connections
♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
♦ VLAN Support According to 802.1p and 802.1Q
♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII
♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus
♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
♦ Glueless SDRAM Buffer Management
♦ Low-Power 1.8V Core, 3.3V I/O
Applications
TDM Circuit Extension Over PSN
o Leased-Line Services Over PSN
o TDM Over GPON/EPON
o TDM Over Cable
o TDM Over Wireless
Cellular Backhaul Over PSN
Multiservice Over Unified PSN
HDLC-Based Traffic Transport Over PSN
产品属性
- 产品编号:
DS34T108GN
- 制造商:
Analog Devices Inc./Maxim Integrated
- 类别:
集成电路(IC) > 专用 IC
- 包装:
卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带
- 类型:
TDM(分时复用)
- 应用:
数据传输
- 安装类型:
表面贴装型
- 封装/外壳:
484-BGA 裸露焊盘
- 供应商器件封装:
484-PBGA-HS(23x23)
- 描述:
IC TDM 484HSBGA
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MAXIM/美信 |
24+ |
NA/ |
3310 |
原装现货,当天可交货,原型号开票 |
询价 | ||
MAXIM |
2016+ |
BGA |
6000 |
只做原装,假一罚十,公司可开17%增值税发票! |
询价 | ||
MAXIM |
13+ |
BGA484 |
155 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
MAXIM/美信 |
25+ |
BGA |
60 |
原装正品,假一罚十! |
询价 | ||
Maxim(美信) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
询价 | ||
MAXIM/美信 |
23+ |
HSBGA-484 |
12700 |
买原装认准中赛美 |
询价 | ||
MAXIM |
24+ |
BGA |
30617 |
主打MAXIM品牌价格绝对优势 |
询价 | ||
DALLAS |
2223+ |
BGA |
26800 |
只做原装正品假一赔十为客户做到零风险 |
询价 | ||
MAXIM/美信 |
24+ |
HSBGA-484 |
30000 |
原装正品公司现货,假一赔十! |
询价 | ||
2017+ |
BGA |
6528 |
只做原装正品假一赔十! |
询价 |