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DS34T102GN中文资料PDF规格书
厂商型号 |
DS34T102GN |
参数属性 | DS34T102GN 封装/外壳为484-BGA;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为集成电路(IC) > 专用 IC;DS34T102GN应用范围:数据传输;产品描述:IC TDM 484TEBGA |
功能描述 | Single/Dual/Quad/Octal TDM-Over-Packet Chip |
文件大小 |
803.77 Kbytes |
页面数量 |
74 页 |
生产厂商 | MaximIntegrated |
企业简称 |
Maxim【美信半导体】 |
中文名称 | 美信半导体官网 |
原厂标识 | |
数据手册 | |
更新时间 | 2024-6-18 13:00:00 |
DS34T102GN规格书详情
General Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.
Features
♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC
♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
♦ 64 Independent Bundles/Connections
♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
♦ VLAN Support According to 802.1p and 802.1Q
♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII
♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus
♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
♦ Glueless SDRAM Buffer Management
♦ Low-Power 1.8V Core, 3.3V I/O
Applications
TDM Circuit Extension Over PSN
o Leased-Line Services Over PSN
o TDM Over GPON/EPON
o TDM Over Cable
o TDM Over Wireless
Cellular Backhaul Over PSN
Multiservice Over Unified PSN
HDLC-Based Traffic Transport Over PSN
产品属性
- 产品编号:
DS34T102GN
- 制造商:
Analog Devices Inc./Maxim Integrated
- 类别:
集成电路(IC) > 专用 IC
- 包装:
卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带
- 类型:
TDM(分时复用)
- 应用:
数据传输
- 安装类型:
表面贴装型
- 封装/外壳:
484-BGA
- 供应商器件封装:
484-BGA(23x23)
- 描述:
IC TDM 484TEBGA
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MAXIM |
21+ |
BGA484 |
50000 |
全新原装正品现货,支持订货 |
询价 | ||
Maxim |
21+ |
NA |
2655 |
原装热卖可订货 |
询价 | ||
MAXIM |
2020+ |
BGA484 |
80000 |
只做自己库存,全新原装进口正品假一赔百,可开13%增 |
询价 | ||
DALLAS |
21+ROHS |
TEBGA |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
询价 | ||
MAXIM |
19+ |
BGA |
256800 |
原厂代理渠道,每一颗芯片都可追溯原厂; |
询价 | ||
MAXIM |
23/22+ |
NA |
1000 |
代理渠道.实单必成 |
询价 | ||
MAXIM/美信 |
23+ |
NA/ |
3278 |
原装现货,当天可交货,原型号开票 |
询价 | ||
MAXIM/美信 |
23+ |
BGA484 |
50000 |
全新原装正品现货,支持订货 |
询价 | ||
Maxim |
21+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
询价 | |||
MAXIM |
21+ |
BGA484 |
88 |
原装现货假一赔十 |
询价 |