首页>DS34T101GN>规格书详情

DS34T101GN集成电路(IC)的专用IC规格书PDF中文资料

DS34T101GN
厂商型号

DS34T101GN

参数属性

DS34T101GN 封装/外壳为484-BGA;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为集成电路(IC)的专用IC;DS34T101GN应用范围:数据传输;产品描述:IC TDM 484TEBGA

功能描述

Single/Dual/Quad/Octal TDM-Over-Packet Chip

封装外壳

484-BGA

文件大小

803.77 Kbytes

页面数量

74

生产厂商 Maxim Integrated Products
企业简称

MAXIM美信

中文名称

美信半导体官网

原厂标识
MAXIM
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-8-4 13:01:00

人工找货

DS34T101GN价格和库存,欢迎联系客服免费人工找货

DS34T101GN规格书详情

General Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

特性 Features

♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC

♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks

♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS

♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes

♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable

♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments

♦ 64 Independent Bundles/Connections

♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet

♦ VLAN Support According to 802.1p and 802.1Q

♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII

♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus

♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing

♦ Glueless SDRAM Buffer Management

♦ Low-Power 1.8V Core, 3.3V I/O

Applications

  TDM Circuit Extension Over PSN

     o Leased-Line Services Over PSN

     o TDM Over GPON/EPON

     o TDM Over Cable

     o TDM Over Wireless

  Cellular Backhaul Over PSN

  Multiservice Over Unified PSN

  HDLC-Based Traffic Transport Over PSN

 

产品属性

  • 产品编号:

    DS34T101GN

  • 制造商:

    Analog Devices Inc./Maxim Integrated

  • 类别:

    集成电路(IC) > 专用 IC

  • 包装:

    卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带

  • 类型:

    TDM(分时复用)

  • 应用:

    数据传输

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    484-BGA

  • 供应商器件封装:

    484-BGA(23x23)

  • 描述:

    IC TDM 484TEBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
MAXIM
23+
BGA484
3
全新原装正品现货,支持订货
询价
MAXIM
2016+
BGA484
1980
只做原装,假一罚十,公司可开17%增值税发票!
询价
MAXIM/美信
22+
BGA484
25000
只做原装进口现货,专注配单
询价
MAXIM
2016+
BGA484
6523
只做进口原装现货!假一赔十!
询价
MAXIM/美信
24+
TEBGA- 484
30000
原装正品公司现货,假一赔十!
询价
MAXIM
21+
BGA484
3
原装现货假一赔十
询价
MAXIM/美信
24+
TEBGA- 484
6000
全新原装深圳仓库现货有单必成
询价
MAXIM
24+
BGA484
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
询价
MAXIM/美信
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
MAXIM/美信
2447
484-BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价