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DS34T104GN集成电路(IC)的专用IC规格书PDF中文资料

DS34T104GN
厂商型号

DS34T104GN

参数属性

DS34T104GN 封装/外壳为484-BGA;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为集成电路(IC)的专用IC;DS34T104GN应用范围:数据传输;产品描述:IC TDM 484TEBGA

功能描述

Single/Dual/Quad/Octal TDM-Over-Packet Chip

封装外壳

484-BGA

文件大小

803.77 Kbytes

页面数量

74

生产厂商 Maxim Integrated Products
企业简称

MAXIM美信

中文名称

美信半导体官网

原厂标识
MAXIM
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-8-4 23:00:00

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DS34T104GN价格和库存,欢迎联系客服免费人工找货

DS34T104GN规格书详情

General Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

特性 Features

♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC

♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks

♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS

♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes

♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable

♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments

♦ 64 Independent Bundles/Connections

♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet

♦ VLAN Support According to 802.1p and 802.1Q

♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII

♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus

♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing

♦ Glueless SDRAM Buffer Management

♦ Low-Power 1.8V Core, 3.3V I/O

Applications

  TDM Circuit Extension Over PSN

     o Leased-Line Services Over PSN

     o TDM Over GPON/EPON

     o TDM Over Cable

     o TDM Over Wireless

  Cellular Backhaul Over PSN

  Multiservice Over Unified PSN

  HDLC-Based Traffic Transport Over PSN

 

产品属性

  • 产品编号:

    DS34T104GN

  • 制造商:

    Analog Devices Inc./Maxim Integrated

  • 类别:

    集成电路(IC) > 专用 IC

  • 包装:

    卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带

  • 类型:

    TDM(分时复用)

  • 应用:

    数据传输

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    484-BGA

  • 供应商器件封装:

    484-BGA(23x23)

  • 描述:

    IC TDM 484TEBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
MAXIM/美信
24+
NA/
337
优势代理渠道,原装正品,可全系列订货开增值税票
询价
MAXIM
24+
BGA
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
询价
MAXIM/美信
25+
BGA
337
原装正品,假一罚十!
询价
MAXIM
2016+
BGA484
3526
假一罚十进口原装现货原盘原标!
询价
Analog Devices Inc./Maxim Inte
25+
484-BGA
1000
只做原装假一罚百可开票可售样
询价
MAXIM
21+
BGA484
284
原装现货假一赔十
询价
DALLAS
24+
BGA484
30617
一级代理全新原装热卖
询价
MAXIM
24+
BGA484
23000
免费送样原盒原包现货一手渠道联系
询价
MAXIM
23+
TEBGA
8888
专做原装正品,假一罚百!
询价
MAXIM
23+
BGA
2567
原厂原装正品
询价