Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

MAXIM

美信

Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

MAXIM

美信

Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

MAXIM

美信

Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

MAXIM

美信

Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

MAXIM

美信

丝印：K34；Package：SOD-123FL；Surface Mount Schottky Barrier Rectifier

Features Metal silicon junction, majority carrier conduction For surface mounted applications Low power loss, high efficiency High forward surge current capability For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications

文件：2.53437 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

3.0A SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features ● Schottky Barrier Chip ● Ideally Suited for Automatic Assembly ● Low Power Loss, High Efficiency ● Surge Overload Rating to 2 0A Peak ● For Use in Low Voltage Application ● Guard Ring Die Construction ● Plastic Case Material has UL Flammability Classification Rating 94V-O Mec

文件：138.3 Kbytes 页数：2 Pages

ZSELEC

淄博圣诺

3.0A SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features e Schottky Barrier Chip © Ideally Suited for Automatic Assembly ® Low Power Loss, High Efficiency e Surge Overload Rating to 2 0A Peak ® For Use in Low Voltage Application ® Guard Ring Die Construction ® Plastic Case Material has UL Flammability Classification Rating

文件：1.21711 Mbytes 页数：3 Pages

TECHPUBLIC

台舟电子

SCHOTTKY BARRIER RECTIFIER REVERSE VOLTAGE 20 TO 200V FORWARD CURRENT 3A

DESCRIPTION The DS32W~DS3 20W are available in SOD 123FL p a ckage FEATURES  M etal silicon junction, majority carrier conduction  For surface mounted applications  Low power loss, high efficiency  High forward surge current capability  For use in low voltage, h igh frequency inv

文件：564.93 Kbytes 页数：5 Pages

AITSEMI

创瑞科技

Quad RS-422, RS-423 Line Receiver

文件：255.42 Kbytes 页数：8 Pages

NSC

国半