Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

文件：277.48 Kbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

丝印：D20；Package：SOT-23；SMD Zener

文件：195.91 Kbytes 页数：1 Pages

TAITRON

丝印：D20JA05；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA10；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA100；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA20；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA40；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA60；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA80；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20SAL；Package：TO-277B；Schottky Barrier Rectifiers

文件：600.46 Kbytes 页数：4 Pages

BILIN

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