丝印：D20；Package：SOT-23；SMD Zener

文件：195.91 Kbytes 页数：1 Pages

TAITRON

丝印：D2097；Package：TO-92；TO-92 Plastic-Encapsulate Transistors

FEATURES Low VCE(sat).VCE(sat) = 0.25V (Typ.)(IC/IB= 4A / 0.1A) Excellent Dc current gain characteristics

文件：1.38154 Mbytes 页数：4 Pages

DGNJDZ

南晶电子

丝印：D2097；Package：TO-92；TO-92 Plastic-Encapsulate Transistors

FEATURES Low VCE(sat).VCE(sat) = 0.25V (Typ.)(IC/IB= 4A / 0.1A) Excellent Dc current gain characteristics

文件：1.38154 Mbytes 页数：4 Pages

DGNJDZ

南晶电子

丝印：D20SAL；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High forward surge current capability. - High temperature soldering guaranteed: 260°C/10 seconds. - low forward voltage drop.

文件：478.43 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D20SBL；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High surge capability. - High temperature soldering guaranteed: 260°C/10 seconds. - High current capability, low forward voltage drop.

文件：475.86 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D20SDL；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High forward surge current capability. - High temperature soldering guaranteed: 260°C/10 seconds. - Robust guarding for over voltage protection. - Low forward voltage drop.

文件：478.79 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D20JA05；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA10；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA100；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D20JA20；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.026329 Mbytes 页数：3 Pages

RFE

RFE international