COM Express Type 6 Compact Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® Processor

Features ● 6th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Skylake-U) ● 2 DDR4-2133 SO-DIMM, up to 32GB ● Max. up to 6 lanes of PCI Express ● 3 SATA-600 ● 4 USB 3.0 and 8 USB 2.0 ● AXView 2.0 intelligent remote management software ● TPM 1.2 supported

文件：363.06 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features ● Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H) ● Intel® CM238/QM175/HM175 chipset ● 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC ● 1 PCIe x16 and 8 PCIe x1 (Gen3) ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and T

文件：437.58 Kbytes 页数：2 Pages

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COM Express Type 6 Application Board with LVDS, VGA, DDI, Dual LANs and Audio

Features ● 125 x 95 mini size form factor ● 2 GbE LANs ● SATA-600 ● LVDS, VGA and DDI ● 4 USB 2.0 and 2 USB 3.0 ● 2 PCI Express Mini Card slots ● 3 RS-232/422/485 and 1 RS-232

文件：406.67 Kbytes 页数：1 Pages

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COM Express Type 6 Application Board with MXM Slot

Features ● MXM type A supported ● SATA-600 ● LVDS, VGA, HDMI, and DisplayPort ● 4 USB 2.0 and 2 USB 3.0 ● 2 PCI Express Mini Card slots ● 3 RS-232/422/485 and 1 RS-232

文件：376.58 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features ● Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H) ● Intel® CM238/QM175/HM175 chipset ● 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC ● 1 PCIe x16 and 8 PCIe x1 (Gen3) ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and T

文件：437.58 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features ● Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H) ● Intel® CM238/QM175/HM175 chipset ● 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC ● 1 PCIe x16 and 8 PCIe x1 (Gen3) ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and T

文件：437.58 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features ● Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H) ● Intel® CM238/QM175/HM175 chipset ● 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC ● 1 PCIe x16 and 8 PCIe x1 (Gen3) ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and T

文件：437.58 Kbytes 页数：2 Pages

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COM Express Type 6 Basic Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features ● Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H) ● Intel® CM238/QM175/HM175 chipset ● 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC ● 1 PCIe x16 and 8 PCIe x1 (Gen3) ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and T

文件：437.58 Kbytes 页数：2 Pages

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COM Express Type 6 Application Board with LVDS, VGA, DDI, Dual LANs and Audio

Features ● 125 x 95 mini size form factor ● 2 GbE LANs ● SATA-600 ● LVDS, VGA and DDI ● 4 USB 2.0 and 2 USB 3.0 ● 2 PCI Express Mini Card slots ● 3 RS-232/422/485 and 1 RS-232

文件：406.67 Kbytes 页数：1 Pages

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COM Express Type 6 Application Board with MXM Slot

Features ● MXM type A supported ● SATA-600 ● LVDS, VGA, HDMI, and DisplayPort ● 4 USB 2.0 and 2 USB 3.0 ● 2 PCI Express Mini Card slots ● 3 RS-232/422/485 and 1 RS-232

文件：376.58 Kbytes 页数：2 Pages

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