100/101, 200/201, 300/301 Threaded Diaphragm Seal

FEATURES „ 316L Stainless steel top housing (standard) „ Available in wide range of wetted materials for process compatibility „ Flushing port (101, 201, 301) provides for easy cleaning of process „ Continuous duty design contains process if instrument is inadvertantly removed „ NSF-61 Compli

文件：2.17319 Mbytes 页数：5 Pages

ASHCROFT

雅斯科

HAND CRIMPING TOOLS

文件：627.65 Kbytes 页数：5 Pages

KSS

京瓷

HAND CRIMPING TOOLS

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KSS

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Submersible Sewage Ejector Pump

文件：1.32176 Mbytes 页数：24 Pages

PENTAIR

滨特尔

丝印：0610NAB；Package：LFPAK56；60 V, 10 A NPN high power bipolar transistor

1. General description NPN high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. PNP complement: PHPT60610PY 2. Features and benefits • High thermal power dissipation capability • High temperature applications up to 175 °C • Reduced Printe

文件：271.47 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：0610NAB；Package：SOT669；60 V, 10 A NPN high power bipolar transistor

1. General description NPN high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. PNP complement: PHPT60610PY-Q 2. Features and benefits • High thermal power dissipation capability • High temperature applications up to 175 °C • Reduced Prin

文件：283.74 Kbytes 页数：14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：0610PAB；Package：LFPAK56；60 V, 10 A PNP high power bipolar transistor

1. General description PNP high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. NPN complement: PHPT60610NY 2. Features and benefits • High thermal power dissipation capability • High temperature applications up to 175 °C • Reduced Printe

文件：269.29 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：0610PAB；Package：SOT669；60 V, 10 A PNP high power bipolar transistor

1. General description PNP high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. NPN complement: PHPT60610NY-Q 2. Features and benefits • High thermal power dissipation capability • High temperature applications up to 175 °C • Reduced Prin

文件：281.16 Kbytes 页数：14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

光电附件

Dialight

光电附件

Dialight