1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

丝印：25M02GWTBIG；Package：TB；1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

丝印：25M02GWTBIT；Package：TB；1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

丝印：25M02GWTCIG；Package：TC；1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

丝印：25M02GWTCIT；Package：TC；1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

丝印：25M02GWZEIG；Package：ZE；1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

丝印：25M02GWZEIT；Package：ZE；1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as C

文件：2.31791 Mbytes 页数：68 Pages

WINBOND

华邦电子

串口式 (SPI) NAND 型闪存

2Gb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default •Vcc: 1.7V to 1.95V\n• Operating temperature: Industrial: -40°C to 85°C\n• Density: 2G-bit/256M-byte\n• Block size: 64 pages (128K + 4K bytes)\n• SPI clocks: 104MHz\n• Block erase time: 2ms(typ.)\n• Package:WSON8 6x8, TFBGA24 6x8;

Winbond

华邦电子

Package：24-TBGA；包装：托盘 类别：集成电路（IC） 存储器 描述：2G-BIT SERIAL NAND FLASH, 1.8V

Winbond Electronics

Package：24-TBGA；包装：管件 类别：集成电路（IC） 存储器 描述：2G-BIT SERIAL NAND FLASH, 1.8V

Winbond Electronics