W25M02GWTBIG集成电路（IC）的存储器规格书PDF中文资料

GENERAL DESCRIPTIONS

The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. All W25N SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for the typical NAND flash memory.

FEATURES

• New Family of SpiFlash Memories

– W25M02GW: 2x1G-bit / 2x128M-Byte

– Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

– Compatible SPI serial flash commands

• Highest Performance Serial NAND Flash

– 104MHz Standard/Dual/Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 40MB/S continuous data transfer rate

– Fast Program/Erase performance

– More than 100,000 erase/program cycles

– More than 10-year data retention

• Efficient “Continuous Read Mode”(1)

– Alternative method to the Buffer Read Mode

– No need to issue “Page Data Read” between

Read commands

– Allows direct read access to the entire array

• Flexible “Concurrent Operations”

– Independent single die access

– Allows “Read while Program/Erase”

– Allows “Multi Die Program/Erase”

– Improves Program/Erase throughput

• Low Power, Wide Temperature Range

– Single 1.70 to 1.95V supply

– 25mA active, 20µA standby current

– -40°C to +85°C operating range

• Flexible Architecture with 128KB blocks

– Uniform 128K-Byte Block Erase

– Flexible page data load methods

• Advanced Features

– On chip 1-Bit ECC for memory array

– ECC status bits indicate ECC results

– bad block management and LUT(2) access

– Software and Hardware Write-Protect

– Power Supply Lock-Down and OTP protection

– 2KB Unique ID and 2KB parameter pages

– Ten 2KB OTP pages(3)

• Space Efficient Packaging

– 8-pad WSON 8x6-mm

– 24-ball TFBGA 8x6-mm

– Contact Winbond for other package options