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W25M02GWZEIT

1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

W25M02GWZEIT

包装:托盘 封装/外壳:8-WDFN 裸露焊盘 类别:集成电路(IC) 存储器 描述:2G-BIT SERIAL NAND FLASH, 1.8V

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

W25M02GWZEIT TR

包装:卷带(TR) 封装/外壳:8-WDFN 裸露焊盘 类别:集成电路(IC) 存储器 描述:2G-BIT SERIAL NAND FLASH, 1.8V

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GVTBIG

3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GVTBIT

3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GVTCIG

3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GVTCIT

3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GVZEIG

3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GVZEIT

3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GWTBIG

1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GWTBIT

1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GWTCIG

1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GWTCIT

1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GWZEIG

1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

25M02GWZEIT

1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH

GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash®seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC

WinbondWinbond Electronics

华邦电子华邦电子股份有限公司

Winbond

CAT25M02

EEPROMSerial2-MbSPI

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ONSEMI

CAT25M02

2MbSPISerialCMOSEEPROM

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ONSEMI

CAT25M02

2MbSPISerialCMOSEEPROM

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ONSEMI

CAT25M02DTR

2MbSPISerialCMOSEEPROM

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ONSEMI

CAT25M02DTR

EEPROMSerial2-MbSPI

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ONSEMI

产品属性

  • 产品编号:

    W25M02GWZEIT

  • 制造商:

    Winbond Electronics

  • 类别:

    集成电路(IC) > 存储器

  • 系列:

    SpiFlash®

  • 包装:

    托盘

  • 存储器类型:

    非易失

  • 存储器格式:

    闪存

  • 技术:

    FLASH - NAND(SLC)

  • 存储容量:

    2Gb(256M x 8)

  • 存储器接口:

    SPI - 四 I/O

  • 写周期时间 - 字,页:

    700µs

  • 电压 - 供电:

    1.7V ~ 1.95V

  • 工作温度:

    -40°C ~ 85°C(TA)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    8-WDFN 裸露焊盘

  • 供应商器件封装:

    8-WSON(8x6)

  • 描述:

    2G-BIT SERIAL NAND FLASH, 1.8V

供应商型号品牌批号封装库存备注价格
Winbond Electronics
21+
8-WDFN 裸露焊盘
15000
正规渠道/品质保证/原装正品现货
询价
华邦
22+
NA
500000
万三科技,秉承原装,购芯无忧
询价
22+
8600
全新正品现货 有挂就有现货
询价
WINBOND
22+
WSON-8 8x6mm
80000
华邦全线/只有原装/价格优势/全线可订
询价
WINBOND
24+25+/26+27+
DFN-8.贴片
6328
一一有问必回一特殊渠道一有长期订货一备货HK仓库
询价
Winbond Electronics
24+
8-WDFN 裸露焊盘
9350
独立分销商,公司只做原装,诚心经营,免费试样正品保证
询价
WINBOND
DIP
21
询价
WINBOND
21+
DIP
6000
绝对原裝现货
询价
WINBOND/华邦
22+
WSON-88x6mm
8900
英瑞芯只做原装正品!!!
询价
Winbond
2022+
原厂原包装
8600
全新原装 支持表配单 中国著名电子元器件独立分销
询价
更多W25M02GWZEIT供应商 更新时间2024-4-18 16:34:00