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RFL60TZ6S

Ultra Fast Recovery Diode

●Features Fast recovery / Ultra soft recovery type Low forward voltage High current overload capacity

文件:1.88997 Mbytes 页数:10 Pages

ROHM

罗姆

RFL60TZ6SGC13

Ultra Fast Recovery Diode

●Features Fast recovery / Ultra soft recovery type Low forward voltage High current overload capacity

文件:1.88997 Mbytes 页数:10 Pages

ROHM

罗姆

RFLW3N

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N_V01

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N1100B

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N2000B

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N2000BMNWS

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N3000B

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N3900C

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

RFLW3N6700C

High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

文件:364.77 Kbytes 页数:5 Pages

VISHAYVishay Siliconix

威世威世科技公司

技术参数

  • Tolerance:

    +/-20%

  • Voltage–Rated:

    160

  • Dielectric:

  • OperatingTemperature:

    -40 ~ 105 °C (see datasheet)

  • Package/Case:

    Radial Can

  • Applications:

    Electronic Ballast

  • MountingType:

    Through Hole

  • Size/Dimension:

    Diameter

  • Height–Seated(Max):

  • Thickness(Max):

  • LeadSpacing:

    (see datasheet)

  • LeadStyle:

    Radial Leaded

  • Features:

    High R.C.

  • LoadLife:

    8000 ~ 10000 Hours @ 105 °C

  • Series:

    RFL

  • Packaging:

    Tape and Reel / Ammo

  • PartStatus:

    Active

供应商型号品牌批号封装库存备注价格
QUALCOMM
05/06+
BGA
14300
全新原装100真实现货供应
询价
STMicroelectronics
24+
QFP
5000
公司存货
询价
QULACOMM
23+
QFN
350
专营高频管模块,全新原装!
询价
QUALCOMM
23+
QFN
5000
原装正品,假一罚十
询价
N/A
24+
6868
原装现货,可开13%税票
询价
WALSIN
2016+
SMD
3500
只做原装,假一罚十,公司可开17%增值税发票!
询价
华新
24+
0603
5000
全现原装公司现货
询价
QUALCOMM
25+
BGA
4100
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
STMicroelectronics
17+
QFP
9800
只做全新进口原装,现货库存
询价
QUALCOMM
07+
QFN
2130
原装现货海量库存欢迎咨询
询价
更多RFL供应商 更新时间2026-1-27 17:23:00