High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

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VishayVishay Siliconix

威世科技

High Frequency Wire Bondable RF Spiral Inductor, 0.030\" x 0.030\"

High frequency\nWire bond assembly\nSmall size: 0.030\" x 0.030\" x 0.020\";

Vishay

威世科技

High Frequency Wire Bondable RF Spiral Inductor, 0.030\ x 0.030\

High frequency\nWire bond assembly\nSmall size: 0.030\" x 0.030\" x 0.020\";

Vishay

威世科技

ANAREN
MODULE

ANAREN

上传：深圳市旺财半导体有限公司

RF
SMD

RF

上传：深圳市星佑电子有限公司