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NX1-15T-KT9K

Simple Assembly Type PC Card Frame Kits

Simple Assembly Type PC Card Frame Kits ■Features 1. Great reduction of the number of frame kit assembly steps Use of this simple assembly method has greatly reduced the number of assembly steps. Processes such heat fusion and cooling of the covers are no longer required. Assembly of

文件:309.54 Kbytes 页数:6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

NX1-25T-KT3K

Simple Assembly Type PC Card Frame Kits

Simple Assembly Type PC Card Frame Kits ■Features 1. Great reduction of the number of frame kit assembly steps Use of this simple assembly method has greatly reduced the number of assembly steps. Processes such heat fusion and cooling of the covers are no longer required. Assembly of

文件:309.54 Kbytes 页数:6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

NX1-25T-KT9K

Simple Assembly Type PC Card Frame Kits

Simple Assembly Type PC Card Frame Kits ■Features 1. Great reduction of the number of frame kit assembly steps Use of this simple assembly method has greatly reduced the number of assembly steps. Processes such heat fusion and cooling of the covers are no longer required. Assembly of

文件:309.54 Kbytes 页数:6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

NX1-32T-KT3K

Simple Assembly Type PC Card Frame Kits

Simple Assembly Type PC Card Frame Kits ■Features 1. Great reduction of the number of frame kit assembly steps Use of this simple assembly method has greatly reduced the number of assembly steps. Processes such heat fusion and cooling of the covers are no longer required. Assembly of

文件:309.54 Kbytes 页数:6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

NX1-32T-KT9K

Simple Assembly Type PC Card Frame Kits

Simple Assembly Type PC Card Frame Kits ■Features 1. Great reduction of the number of frame kit assembly steps Use of this simple assembly method has greatly reduced the number of assembly steps. Processes such heat fusion and cooling of the covers are no longer required. Assembly of

文件:309.54 Kbytes 页数:6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

NX138AKH

丝印:0001;Package:SOT8001;60 V, N-channel Trench MOSFET

1. General description N-channel enhancement mode Field-Effect Transistor (FET) in a leadless, ultra small DFN0606-3 (SOT8001) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Logic-level compatible • Very fast switching • Trench MOSFET

文件:286.38 Kbytes 页数:14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

NX138AKM

丝印:6A;Package:SOT883;60 V, N-channel Trench MOSFET

1. General description N-channel enhancement mode Field-Effect Transistor (FET) in a leadless, ultra small DFN1006-3 (SOT883) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Logic-level compatible • Very fast switching • Trench MOSFET t

文件:282.74 Kbytes 页数:14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

NX138BKH

丝印:0001;Package:SOT8001;60 V, N-channel Trench MOSFET

1. General description N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN0606-3 (SOT8001) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Low threshold voltage • Very fast switching • Trench MOSFET te

文件:286.09 Kbytes 页数:14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

NX138BKM

丝印:6R;Package:SOT883;60 V, N-channel Trench MOSFET

1. General description N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1006-3 (SOT883) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Low threshold voltage • Very fast switching • Trench MOSFET tec

文件:280.6 Kbytes 页数:14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

NX1440

Injection Molding

Excellent mold release Fast cycle Fatigue resistance General purpose

文件:450.24 Kbytes 页数:2 Pages

NYLENE

技术参数

  • Package name:

    SOT666

  • Product status:

    Production

  • Channel type:

    N/P

  • Nr of transistors:

    2

  • VDS [max] (V):

    60

  • VGS [max] (V):

    20

  • RDSon [max] @ VGS = 10 V (mΩ):

    1600

  • RDSon [max] @ VGS = 5 V (mΩ):

    2000

  • integrated gate-source ESD protection diodes:

    Y

  • VESD HBM (V):

    2000

  • Tj [max] (°C):

    150

  • ID [max] (A):

    0.33

  • QGD [typ] (nC):

    0.1

  • QG(tot) [typ] @ VGS = 4.5 V (nC):

    0.5

  • Ptot [max] (W):

    0.33

  • VGSth [typ] (V):

    1.6

  • Automotive qualified:

    N

  • Ciss [typ] (pF):

    33

  • Coss [typ] (pF):

    7

  • Release date:

    2011-08-12

供应商型号品牌批号封装库存备注价格
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6000
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MICRON
23+
BGA
5000
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ndk
24+
58000
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恩XP
17+
NA
6200
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WESTCODE
23+
模块
420
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CAPCOM
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74
全新原装100真实现货供应
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恩XP
16+
NA
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恩XP
1645+
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7500
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更多NX1供应商 更新时间2025-10-9 9:01:00