MINI SHUNTS .050 & .100 [2.54] CENTERLINE

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ADAM-TECH

亚当科技

1200V, 50A, BL1, Phase Leg Trench 4 Fast + mSiC™ Diode Baseplate-less Hybrid Module

'•High speed IGBT 4•Kelvin emitter for easy drive•Very low stray inductance•Ultra low weight and profile•High efficiency converter•Direct mounting to heatsink (isolated package)•Low junction to case thermal resistance•RoHS Compliant High speed IGBT 4\nKelvin emitter for easy drive\nVery low stray inductance\nUltra low weight and profile;

Microchip

微芯科技

1200V, 50A, BL2, Double Dual Common Emitter Trench 4 Fast + mSiC™ Diode Baseplate-less Hybrid Module

'•High speed IGBT 4•Kelvin emitter for easy drive•Very low stray inductance•Ultra low weight and profile•High efficiency converter•Direct mounting to heatsink (isolated package)•Low junction to case thermal resistance•RoHS Compliant

Microchip

微芯科技

1200V, 50A, BL2, Asymmetrical Bridge Trench 4 Fast + mSiC™ Diode Baseplate-less Hybrid Module

'•High speed IGBT 4•Kelvin emitter for easy drive•Very low stray inductance•Ultra low weight and profile•High efficiency converter•Direct mounting to heatsink (isolated package)•Low junction to case thermal resistance•RoHS Compliant High speed IGBT 4\nKelvin emitter for easy drive;

Microchip

微芯科技

包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：PM-IGBT-SP4

Microchip

微芯科技

包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：PM-IGBT-SP4

Microchip

微芯科技

包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：PM-IGBT-SP4

Microchip

微芯科技