350mW SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：109.72 Kbytes 页数：5 Pages

DIODES

美台半导体

410 mW Zener Diode 2.4 to 39 Volts

Features • Halogen free available upon request by adding suffix -HF • Lead Free Finish/RoHS Compliant (P Suffix designates RoHS Compliant. See ordering information) • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Wide Voltage Range Available • Small Outline P

文件：617.71 Kbytes 页数：4 Pages

MCC

丝印：AA；Package：SOT-23；SILICON PLANAR ZENER DIODES

文件：239.22 Kbytes 页数：3 Pages

SEMTECH

先之科

Surface Mount Zener Diodes

Surface Mount Zener Diodes Features: * 225mw Power Dissipation * Ideal for Surface Mountted Application * Case : SOT-23 Molded plastic Mechanical Data: * Zener Breakdown Voltage Range 2.4V to 91V * Terminals: Solderable per MIL-STD-202, Method 208 * Polarity: Cathode Indicated by Polarity

文件：268.14 Kbytes 页数：5 Pages

WEITRON

300 MW Surface Mount Zener Diodes

Features ● Planar Die Construction ● 300 mW Power Dissipation on FR-4 PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Process

文件：372.69 Kbytes 页数：2 Pages

SUNMATE

森美特

350mW Surface Mount Zener Diode

FEATURES ● Planar Die Construction. ● 350mw Power Dissipation. ● General purpose, medium current. ● Ideally Suited For Automated Assembly Prcesses. APPLICATIONS ● 350Mw Surface mount zener diode

文件：219.53 Kbytes 页数：5 Pages

BILIN

银河微电

Zener Diode

Features • a225 mW Rating on FR–4 or FR–5 Board. • aSilicon epitaxial planar chip strucuction. • aWide zener reverse voltage range 2.4V to 91V. • aSmall package size for high density applications. • aIdeally suited for automated assembly processes. • aLead-free parts meet environmental stand

文件：555.12 Kbytes 页数：8 Pages

FORMOSA

美丽微半导体

Surface Mount Zener Voltage Regulator Diodes

FEATURES ● Planar Die Construction ● 300 mW Power Dissipation on FR-4 PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Process

文件：196.72 Kbytes 页数：4 Pages

SECOS

喜可士

丝印：KC5；Package：SOT-23；Planar Die Construction

FEATURES • Planar Die construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：856.69 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

Plastic-Encapsulate Diodes

FEATURES • Planar Die construction • 500mW Power Dissipation • Zener Voltages from 2.4V - 39V • Ideally Suited for Automated Assembly Processes

文件：416.49 Kbytes 页数：3 Pages

HOTTECH

合科泰