LZ52C30W

Marking：30；Package：1206；SURFACE MOUNT ZENER DIODE

FEATURES •Forsurfacemountedapplication •Siliconepitaxialplanardiode •Ultrasmallsurfacemountpackage •Lowleakagecurrent •2tolerancedeviceofVz •Lead-FreeFinish;RoHSCompliant(Notes1&2) •HalogenandAntimonyFree.“Green”Device(Note3)

AD-BZT52C30S

Plastic-EncapsulatedDiode

FEATURES ⚫Planardieconstruction ⚫200mWpowerdissipationonceramicPBC ⚫Generalpurpose,mediumcurrent ⚫AEC-Q101qualified

BZM52C30

0.5W30VZenerdiode

BZT52C30

0.5W30VZenerdiode

BZT52C30

SurfacemountSiliconPlanarZenerDiodes

BZT52C30

SurfacemountZenerDiodes

Features SharpZenervoltagebreakdown Lowleakagecurrent ComplianttoRoHS(exemp.7a) REACH,ConflictMinerals1) TypicalApplications Voltagestabilizationandregulators (Forovervoltageprotection seeTVSdiodesSMFseries) Commercial/industrialgrade Su

BZT52C30

SurfaceMountZenerDiode

FEATURES ●StandardZenerBreakdownVoltageRange:2.4Vto 43V ●SteadyStatePowerRatingof500mW ●SmallBodyOutlineDimensions:3.70mmx1.60mm ●LowBodyHeight:1.05mm ●PackageWeight:10.00mg/unit ●ESDRatingofClass3(>16KV)perHumanBody Model

BZT52C30

SILICONPLANARZENERDIODES

Features •IdeallySuitedforAutomatedAssemblyProcesses •Totalpowerdissipation:max.500mW

BZT52C30

410mWTwoTerminalsSMDZenerDiodes

410mWTwoTerminalsSMDZenerDiodes Features •PlanarDieConstruction •410mWPowerDissipation •ZenerVoltage2.4vto51v •RoHSCompliance

BZT52C30

SURFACEMOUNTZENERDIODE

Features ●PlanarDieConstruction ●500mWPowerDissipationonCeramicPCB ●GeneralPurpose,MediumCurrent ●IdeallySuitedforAutomatedAssembly Processes