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LMG3410R050RWHT.B

丝印:LMG3410R050;Package:VQFN;LMG341xR050 600-V 50-mΩ Integrated GaN Fet Power Stage With Overcurrent Protection

1 Features 1• TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles • Enables high density power conversion designs – Superior system performance over cascode or stand-alone GaN FETs – Low inductance 8 mm x 8 mm QFN package for ease of design, and l

文件:1.11774 Mbytes 页数:37 Pages

TI

德州仪器

LMG3410R050RWHT.B

LMG341xR050 600-V 50-mΩ Integrated GaN Fet Power Stage With Overcurrent Protection

1 Features 1• TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles • Enables high density power conversion designs – Superior system performance over cascode or stand-alone GaN FETs – Low inductance 8 mm x 8 mm QFN package for ease of design, and l

文件:1.1146 Mbytes 页数:37 Pages

TI

德州仪器

LMG3410R070

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06054 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06055 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070_V01

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06055 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070RWHR

丝印:LMG3410R070;Package:VQFN;LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06054 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070RWHR

丝印:LMG3410R070;Package:VQFN(RWH);LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06055 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070RWHR.A

丝印:LMG3410R070;Package:VQFN(RWH);LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06055 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070RWHR.A

丝印:LMG3410R070;Package:VQFN;LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06054 Mbytes 页数:35 Pages

TI

德州仪器

LMG3410R070RWHR.B

丝印:LMG3410R070;Package:VQFN;LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

文件:1.06054 Mbytes 页数:35 Pages

TI

德州仪器

技术参数

  • VDS (Max)(V):

    600

  • ID (Max)(A):

    12

  • RDS (on) (Milliohm):

    70

  • Coss (pF):

    71

  • VCC (V):

    12

  • Logic Level:

    3V to 5V CMOS and TTL

  • Prop Delay (ns):

    20

  • Control Method:

    External

供应商型号品牌批号封装库存备注价格
TI/德州仪器
23+
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
TI/德州
2018+
3Vto5VCMOSandTTL
32500
德州代理承诺销售原装正品公司可开正规17%增值税票
询价
TI/德州仪器
23+
32-VQFN
4256
原装正品代理渠道价格优势
询价
TI(德州仪器)
2021+
VQFN-32(8x8)
499
询价
TI/德州仪器
24+
VQFN-32
9600
原装现货,优势供应,支持实单!
询价
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
询价
TI
23+
N/A
560
原厂原装
询价
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
TI(德州仪器)
2021+
8000
原装现货,欢迎询价
询价
TI/德州仪器
25+
VQFN-32
8880
原装认准芯泽盛世!
询价
更多LMG3410供应商 更新时间2026-1-26 11:10:00